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SN74ALVC3641-10PQ

Texas Instruments

SN74ALVC3641-10PQ by Texas Instruments

SN74ALVC3641-10PQ by Texas Instruments is a 1Kx36 CMOS FIFO memory with 10ns cycle time, operating at 3.3V. It features synchronous operation, parallel interface, and output enable function. This device is ideal for applications requiring fast data transfer and temporary storage in commercial temperature environments.

Median Price

$14.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$14.270

1k+ parts

-

10k+ parts

-

350

-

$14.270

-

-

Rochester

USA . 335 parts In-Stock

1+ parts

-

100+ parts

$12.350

1k+ parts

$11.050

10k+ parts

$10.400

335

-

$12.350

$11.050

$10.400

Verical

USA . 309 parts In-Stock

1+ parts

-

100+ parts

$15.438

1k+ parts

$13.813

10k+ parts

$13.000

309

-

$15.438

$13.813

$13.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,133 parts In-Stock

1+ parts

$13.034

100+ parts

-

1k+ parts

-

10k+ parts

-

2,133

$13.034

-

-

-

Vyrian

USA . 5,616 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,616

-

-

-

-

DigiKey Marketplace

USA . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

350

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 399 parts In-Stock

1+ parts

$4.910

100+ parts

-

1k+ parts

$5.443

10k+ parts

-

399

$4.910

-

$5.443

-

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$5.126

100+ parts

$4.665

1k+ parts

$4.203

10k+ parts

-

350

$5.126

$4.665

$4.203

-

DigiPath Technology Company

USA . 1,223 parts In-Stock

1+ parts

$5.407

100+ parts

$4.974

1k+ parts

-

10k+ parts

-

1,223

$5.407

$4.974

-

-

ChromeModa Solutions

Germany . 6,090 parts In-Stock

1+ parts

$5.517

100+ parts

$4.524

1k+ parts

-

10k+ parts

-

6,090

$5.517

$4.524

-

-

IDEA Electronic Components Group

UK . 2,109 parts In-Stock

1+ parts

$5.517

100+ parts

-

1k+ parts

$4.965

10k+ parts

-

2,109

$5.517

-

$4.965

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Corphita

USA . 2,956 parts In-Stock

1+ parts

$12.348

100+ parts

-

1k+ parts

-

10k+ parts

-

2,956

$12.348

-

-

-

Component Stockers USA

USA . 713 parts In-Stock

1+ parts

$14.190

100+ parts

$13.340

1k+ parts

-

10k+ parts

-

713

$14.190

$13.340

-

-

Microchip USA

USA . 462 parts In-Stock

1+ parts

$39.960

100+ parts

$39.390

1k+ parts

$39.100

10k+ parts

$38.810

462

$39.960

$39.390

$39.100

$38.810

QUARKTWIN TECHNOLOGY LTD

USA . 3,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,622

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Overview

Experience seamless data transfer with the Texas Instruments SN74ALVC3641-10PQ, a top-of-the-line FIFO memory IC. Crafted with precision and expertise by Texas Instruments, this product offers unparalleled reliability and performance in various applications. From telecommunications to industrial automation, this versatile device ensures smooth operations and efficient data handling. Trust in Texas Instruments to deliver cutting-edge technology that elevates your systems to new heights of excellence. Upgrade to the SN74ALVC3641-10PQ today and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan.

Cycle Time: 10 ns

Fast operation speed allows for efficient data processing and retrieval.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for stable and reliable performance.

No. of Terminals: 132

Sufficient terminals for connecting to other components and systems.

Organization: 1KX36

Organized layout for easy management and access of stored data.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance.

Memory IC Type: BI-DIRECTIONAL FIFO

Bi-directional FIFO design allows for efficient data flow in both directions.

Output Enable: YES

Enables the control of data output, providing flexibility in data transmission.

Maximum Access Time: 7.5 ns

Quick access time ensures timely retrieval of data when needed.

Technical Specifications

FIFO SN74ALVC3641-10PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

7.5 ns

Cycle Time:

10 ns

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Memory Density:

36864 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

132

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FIFOs

Maximum Supply Current:

.35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.13 mm

Trade Compliance

SN74ALVC3641-10PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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