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SN74ACT7881-30FN

Texas Instruments

SN74ACT7881-30FN by Texas Instruments

SN74ACT7881-30FN by Texas Instruments is a FIFO chip with 1Kx18 organization, 30 ns cycle time, and 33.4 MHz clock frequency. It operates synchronously at 5V and has a memory density of 18432 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$19.670

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 387 parts In-Stock

1+ parts

-

100+ parts

$17.010

1k+ parts

$15.220

10k+ parts

$14.330

387

-

$17.010

$15.220

$14.330

DigiKey

USA . 387 parts In-Stock

1+ parts

-

100+ parts

$19.670

1k+ parts

-

10k+ parts

-

387

-

$19.670

-

-

Verical

USA . 315 parts In-Stock

1+ parts

-

100+ parts

$21.262

1k+ parts

$19.025

10k+ parts

$17.913

315

-

$21.262

$19.025

$17.913

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,363 parts In-Stock

1+ parts

$17.964

100+ parts

-

1k+ parts

-

10k+ parts

-

4,363

$17.964

-

-

-

Vyrian

USA . 6,744 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,744

-

-

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DigiKey Marketplace

USA . 387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

387

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,245 parts In-Stock

1+ parts

$4.504

100+ parts

-

1k+ parts

$4.946

10k+ parts

-

1,245

$4.504

-

$4.946

-

DigiPath Technology Company

USA . 1,671 parts In-Stock

1+ parts

$4.960

100+ parts

-

1k+ parts

-

10k+ parts

-

1,671

$4.960

-

-

-

ChromeModa Solutions

Germany . 4,243 parts In-Stock

1+ parts

$5.061

100+ parts

$4.150

1k+ parts

-

10k+ parts

-

4,243

$5.061

$4.150

-

-

IDEA Electronic Components Group

UK . 1,208 parts In-Stock

1+ parts

$5.061

100+ parts

-

1k+ parts

$4.555

10k+ parts

-

1,208

$5.061

-

$4.555

-

Ampacity Inc.

Singapore . 60 parts In-Stock

1+ parts

$16.070

100+ parts

-

1k+ parts

-

10k+ parts

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60

$16.070

-

-

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Corphita

USA . 706 parts In-Stock

1+ parts

$17.019

100+ parts

-

1k+ parts

-

10k+ parts

-

706

$17.019

-

-

-

Component Stockers USA

USA . 376 parts In-Stock

1+ parts

$19.190

100+ parts

$18.040

1k+ parts

-

10k+ parts

-

376

$19.190

$18.040

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-

Microchip USA

USA . 200 parts In-Stock

1+ parts

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100+ parts

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200

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Overview

Unlock the power of seamless data transfer with the SN74ACT7881-30FN from Texas Instruments. As a leader in innovative technology, Texas Instruments delivers superior quality and reliability in their products. The FIFO category is essential for applications requiring efficient data storage and retrieval. With a cycle time of 30 ns and a maximum clock frequency of 33.4 MHz, this chip carrier package offers unmatched performance. Experience the benefits of synchronous operation and 3-STATE output characteristics, providing flexibility and speed to your designs. Trust Texas Instruments for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the components inside, ensuring the product can withstand various environmental conditions.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination, making the FIFO efficient and reliable in data processing.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V allows for compatibility with standard power sources and makes integration into existing systems easier.

Maximum Clock Frequency (fCLK): 33.4 MHz

With a high maximum clock frequency, the FIFO can handle rapid data transfers and processing speeds, ideal for applications requiring quick response times.

Memory Width: 18

The 18-bit memory width allows for handling and storing larger amounts of data, making this FIFO suitable for applications with higher data requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of the FIFO.

Maximum Access Time: 18 ns

The low maximum access time ensures fast data retrieval, reducing latency and improving overall system performance.

Technical Specifications

FIFO SN74ACT7881-30FN attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

18 ns

Maximum Clock Frequency (fCLK):

33.4 MHz

Cycle Time:

30 ns

JESD-30 Code:

S-PQCC-J68

Length:

24.23 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

18

No. of Functions:

1

No. of Terminals:

68

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.23 mm

Trade Compliance

SN74ACT7881-30FN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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