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SMJ320C50GFAM50

Texas Instruments

SMJ320C50GFAM50 by Texas Instruments

SMJ320C50GFAM50 by Texas Instruments is a 16-bit DSP with max supply voltage of 5.25V, operating at 50MHz clock frequency. Ideal for military applications due to MIL-PRF-38535 screening level and -55 to 125 °C temp range. Features include 1056 RAM words, 16-bit data bus width, and low power mode for efficient performance.

Median Price

$869.659

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5 parts In-Stock

1+ parts

$723.237

100+ parts

$654.654

1k+ parts

$623.480

10k+ parts

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5

$723.237

$654.654

$623.480

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Rochester

USA . 4 parts In-Stock

1+ parts

$773.030

100+ parts

$726.650

1k+ parts

$680.270

10k+ parts

-

4

$773.030

$726.650

$680.270

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Verical

USA . 4 parts In-Stock

1+ parts

$966.288

100+ parts

$908.313

1k+ parts

$850.337

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4

$966.288

$908.313

$850.337

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DigiKey

USA . 4 parts In-Stock

1+ parts

$966.290

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4

$966.290

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Distributors (In-Stock)

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Digiode

USA . 3,575 parts In-Stock

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$687.075

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3,575

$687.075

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DigiKey Marketplace

USA . 13 parts In-Stock

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$900.650

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13

$900.650

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TME

Poland . 18 parts In-Stock

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$1,212.001

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18

$1,212.001

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Vyrian

USA . 8,178 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Corohmni

South Africa . 935 parts In-Stock

1+ parts

$17.483

100+ parts

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935

$17.483

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Parana Technologies

USA . 2,279 parts In-Stock

1+ parts

$67.337

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2,279

$67.337

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ChromeModa Solutions

Germany . 5,531 parts In-Stock

1+ parts

$75.659

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$62.040

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5,531

$75.659

$62.040

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IDEA Electronic Components Group

UK . 46 parts In-Stock

1+ parts

$75.659

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$71.876

1k+ parts

$68.093

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46

$75.659

$71.876

$68.093

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Microchip USA

USA . 1,485 parts In-Stock

1+ parts

$637.490

100+ parts

$614.310

1k+ parts

$602.720

10k+ parts

$591.130

1,485

$637.490

$614.310

$602.720

$591.130

Corphita

USA . 4,235 parts In-Stock

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$650.913

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$650.913

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DigiPath Technology Company

USA . 2,131 parts In-Stock

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$68.214

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$68.214

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Overview

Unlock unparalleled performance and precision with the SMJ320C50GFAM50 by Texas Instruments! Crafted with top-notch quality and cutting-edge technology, this Digital Signal Processor (DSP) is designed to elevate your audio, video, and communication applications. With a MIL-PRF-38535 screening level, you can trust in its reliability and durability. Experience seamless operation and unmatched efficiency with this powerhouse, offering exceptional value and benefits to customers seeking superior performance. Elevate your projects to new heights with the SMJ320C50GFAM50!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and protection to the DSP, making it suitable for rugged environments.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in powering the DSP without risking damage.

On Chip Data RAM Width: 16

Having a wide data RAM width enables faster processing and handling of data within the DSP.

Address Bus Width: 16

A wide address bus width allows for efficient memory addressing and data access within the DSP.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this DSP can function reliably in harsh environmental conditions.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency enables fast data processing and execution speeds in the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a dedicated digital signal processor ensures optimized performance for signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) SMJ320C50GFAM50 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P141

JESD-609 Code:

e0

Length:

26.925 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

6

No. of Serial I/Os:

1

No. of Terminals:

141

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

SPGA141,19X19

Package Shape:

Package Style (Meter):

GRID ARRAY, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1056

ROM Programmability:

MROM

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

225 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

PERPENDICULAR

Width:

26.925 mm

Peripheral IC Type:

Trade Compliance

SMJ320C50GFAM50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-525-4531, 5962015254531

NIIN

015254531

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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