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SM32C6712DGDPA16EP

Texas Instruments

SM32C6712DGDPA16EP by Texas Instruments

Texas Instruments SM32C6712DGDPA16EP is a 32-bit DSP with 166MHz clock frequency, 65536 RAM words, and 22-bit address bus width. Ideal for industrial applications requiring high-speed processing, it features low power mode and boundary scan capability.

Median Price

$29.150

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 38 parts In-Stock

1+ parts

-

100+ parts

$29.010

1k+ parts

$25.960

10k+ parts

$24.430

38

-

$29.010

$25.960

$24.430

DigiKey

USA . 38 parts In-Stock

1+ parts

-

100+ parts

$29.150

1k+ parts

-

10k+ parts

-

38

-

$29.150

-

-

Verical

USA . 38 parts In-Stock

1+ parts

-

100+ parts

$36.263

1k+ parts

$32.450

10k+ parts

$30.538

38

-

$36.263

$32.450

$30.538

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,945 parts In-Stock

1+ parts

$26.628

100+ parts

-

1k+ parts

-

10k+ parts

-

1,945

$26.628

-

-

-

Vyrian

USA . 3,559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,559

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,038 parts In-Stock

1+ parts

$20.740

100+ parts

$20.440

1k+ parts

$20.300

10k+ parts

$20.150

2,038

$20.740

$20.440

$20.300

$20.150

Corphita

USA . 2,511 parts In-Stock

1+ parts

$25.227

100+ parts

-

1k+ parts

-

10k+ parts

-

2,511

$25.227

-

-

-

Corohmni

South Africa . 797 parts In-Stock

1+ parts

$43.319

100+ parts

-

1k+ parts

-

10k+ parts

-

797

$43.319

-

-

-

Parana Technologies

USA . 1,140 parts In-Stock

1+ parts

$62.104

100+ parts

$5,767.317

1k+ parts

$55.894

10k+ parts

-

1,140

$62.104

$5,767.317

$55.894

-

DigiPath Technology Company

USA . 1,953 parts In-Stock

1+ parts

$68.384

100+ parts

-

1k+ parts

-

10k+ parts

-

1,953

$68.384

-

-

-

ChromeModa Solutions

Germany . 6,176 parts In-Stock

1+ parts

$69.780

100+ parts

$57.220

1k+ parts

-

10k+ parts

-

6,176

$69.780

$57.220

-

-

IDEA Electronic Components Group

UK . 1,316 parts In-Stock

1+ parts

$69.780

100+ parts

$66.291

1k+ parts

$62.802

10k+ parts

-

1,316

$69.780

$66.291

$62.802

-

Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Overview

Enhance your digital signal processing projects with the high-quality SM32C6712DGDPA16EP DSP by Texas Instruments. Known for their exceptional manufacturing standards, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This DSP offers unmatched value and benefits, providing customers with superior performance and reliability. Upgrade your technology with the SM32C6712DGDPA16EP and experience the advantages of top-tier innovation in the field of digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 1.32 V

Operating within this voltage range ensures the stability and reliability of the processor.

Address Bus Width: 22

A wider address bus allows for handling larger amounts of data, enhancing the processing capabilities of the DSP.

Bit Size: 32

A 32-bit architecture provides high computational power and precision for signal processing tasks.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows flexibility in system design and optimization.

No. of Terminals: 272

The high number of terminals enables ample connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY

The grid array package style offers high mechanical strength and efficient thermal performance.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 105 °C

The high operating temperature range makes this DSP suitable for industrial applications where temperatures can vary.

No. of External Interrupts: 4

Having multiple external interrupts allows the processor to respond quickly to external events or signals.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the processor's functionality in harsh environmental conditions.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and electrical conductivity for reliable connections.

RAM Words: 65536

Large RAM capacity allows for efficient data storage and processing, enhancing the overall performance of the DSP.

Width: 27 mm

Compact width dimension enables space-efficient integration of the DSP into various electronic devices.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the DSP during manufacturing and maintenance processes.

External Data Bus Width: 16

A wider external data bus allows for faster data transfer rates, improving the efficiency of data processing.

Maximum Clock Frequency: 166 MHz

High clock frequency enables fast execution of signal processing algorithms, enhancing the real-time performance of the DSP.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making the DSP installation process more efficient.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable operation in various challenging environments commonly found in industrial applications.

No. of Timers: 2

Multiple timers enable precise time management and synchronization, essential for signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the energy efficiency of the DSP.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and mechanical stability for the processor's integration into the system.

Nominal Supply Voltage: 1.2 V

Having a stable nominal supply voltage ensures consistent performance and longevity of the DSP.

No. of DMA Channels: 16

Multiple DMA channels enable efficient data transfer between the DSP and peripheral devices, enhancing overall system performance.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for easy interfacing with other components, simplifying the system integration process.

Format: FLOATING POINT

Support for floating-point format enables precise mathematical calculations, essential for complex signal processing algorithms.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the DSP's resistance to moisture-related issues, ensuring reliable operation in varying environmental conditions.

Low Power Mode: YES

Having a low-power mode enhances energy efficiency and battery life, making the DSP suitable for portable and battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) SM32C6712DGDPA16EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

166 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

272

No. of Timers:

2

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

2.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SM32C6712DGDPA16EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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