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SM32C6415EGLZ50SEP

Texas Instruments

SM32C6415EGLZ50SEP by Texas Instruments

Texas Instruments SM32C6415EGLZ50SEP DSP features 23-bit address bus, 64-bit external data bus, and 33 MHz clock frequency. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,126 parts In-Stock

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Digiode

USA . 1,509 parts In-Stock

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1,509

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Distributors (Availability)

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AZTECH Wire

Italy . 760 parts In-Stock

1+ parts

$13.235

100+ parts

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760

$13.235

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Ampacity Inc.

Singapore . 762 parts In-Stock

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$22.000

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762

$22.000

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One Stop Electronics

USA . 1,396 parts In-Stock

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$29.000

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$29.000

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Microchip USA

USA . 1,731 parts In-Stock

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$31.950

100+ parts

$31.490

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$31.260

10k+ parts

$31.040

1,731

$31.950

$31.490

$31.260

$31.040

Corohmni

South Africa . 293 parts In-Stock

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$40.897

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293

$40.897

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Parana Technologies

USA . 2,346 parts In-Stock

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$64.749

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2,346

$64.749

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DigiPath Technology Company

USA . 358 parts In-Stock

1+ parts

$71.297

100+ parts

$65.593

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358

$71.297

$65.593

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ChromeModa Solutions

Germany . 2,538 parts In-Stock

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$72.752

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$59.657

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2,538

$72.752

$59.657

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IDEA Electronic Components Group

UK . 312 parts In-Stock

1+ parts

$72.752

100+ parts

$69.114

1k+ parts

$65.477

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312

$72.752

$69.114

$65.477

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Corphita

USA . 3,659 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Lixinc

USA . 240 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the SM32C6415EGLZ50SEP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This Digital Signal Processor (DSP) is versatile and efficient, making it ideal for a wide range of applications. From audio processing to telecommunications, this product offers unparalleled performance and value to customers. Experience seamless integration, high-speed processing, and optimized power consumption with the SM32C6415EGLZ50SEP - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components of the DSP.

Integrated Cache: YES

Improves the speed and efficiency of data processing.

Maximum Supply Voltage: 1.31 V

Allows for reliable operation within a safe voltage range.

Address Bus Width: 23

Enables efficient memory addressing for data processing.

Bit Size: 32

Offers high processing capability for complex algorithms.

No. of Terminals: 532

Provides versatility in connecting to various external components.

Minimum Operating Temperature: -55 °C

Ensures functionality in extreme cold environments.

RAM Words: 16384

Offers ample memory storage for data processing.

Maximum Clock Frequency: 33 MHz

Enables fast data processing and real-time signal handling.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed for digital signal processing applications.

Technology: CMOS

Provides low power consumption and high noise immunity.

Technical Specifications

Digital Signal Processors (DSPs) SM32C6415EGLZ50SEP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

33 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.31 V

Minimum Supply Voltage:

1.19 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

SM32C6415EGLZ50SEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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