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SM320VC33GNMM150EP

Texas Instruments

SM320VC33GNMM150EP by Texas Instruments

Texas Instruments SM320VC33GNMM150EP is a 32-bit DSP with 24-bit address bus, operating at max 100MHz. Ideal for military applications, it features low power mode, barrel shifter, and 32768 RAM words. With a ceramic-metal package and grid array style, it supports external data bus width of 32 bits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,480 parts In-Stock

1+ parts

-

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6,480

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Digiode

USA . 1,576 parts In-Stock

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1,576

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Distributors (Availability)

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AZTECH Wire

Italy . 583 parts In-Stock

1+ parts

$10.783

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-

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583

$10.783

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Parana Technologies

USA . 1,401 parts In-Stock

1+ parts

$13.931

100+ parts

$1,293.720

1k+ parts

$12.538

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1,401

$13.931

$1,293.720

$12.538

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DigiPath Technology Company

USA . 974 parts In-Stock

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$15.340

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974

$15.340

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IDEA Electronic Components Group

UK . 1,348 parts In-Stock

1+ parts

$15.653

100+ parts

$14.870

1k+ parts

$14.088

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-

1,348

$15.653

$14.870

$14.088

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ChromeModa Solutions

Germany . 331 parts In-Stock

1+ parts

$15.653

100+ parts

$12.835

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331

$15.653

$12.835

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One Stop Electronics

USA . 657 parts In-Stock

1+ parts

$23.000

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657

$23.000

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Corohmni

South Africa . 225 parts In-Stock

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$74.494

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225

$74.494

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Component Stockers USA

USA . 674 parts In-Stock

1+ parts

$99.990

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674

$99.990

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Corphita

USA . 2,363 parts In-Stock

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Microchip USA

USA . 168 parts In-Stock

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168

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Overview

Experience unparalleled performance with the SM320VC33GNMM150EP by Texas Instruments, a top-of-the-line Digital Signal Processor (DSP) designed for precision and reliability. Crafted with premium quality materials and cutting-edge technology, this processor offers seamless integration and exceptional power efficiency. Ideal for a wide range of applications, from audio processing to telecommunications, this product delivers unmatched value and benefits to customers seeking high-performance solutions. Upgrade your system with Texas Instruments and elevate your performance to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides strong and durable packaging, ensuring reliability and longevity of the product.

Maximum Supply Voltage: 1.89 V

Allows for efficient power usage and compatibility with various power sources.

Bit Size: 32

Offers high processing capabilities and performance for demanding applications.

Temperature Grade: MILITARY

Designed to withstand harsh environmental conditions, making it suitable for military applications.

Maximum Clock Frequency: 100 MHz

Enables fast data processing and response times, ideal for real-time signal processing.

Technical Specifications

Digital Signal Processors (DSPs) SM320VC33GNMM150EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CBGA-B144

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

2.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

SM320VC33GNMM150EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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