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SM320C32PCMM50EP

Texas Instruments

SM320C32PCMM50EP by Texas Instruments

Texas Instruments SM320C32PCMM50EP DSP features 32-bit architecture, 512 RAM words, and 50 MHz clock frequency. Ideal for military applications due to its CMOS technology, low power mode, and integrated cache for efficient signal processing.

Median Price

$90.229

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,993 parts In-Stock

1+ parts

$74.470

100+ parts

-

1k+ parts

-

10k+ parts

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2,993

$74.470

-

-

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Vyrian

USA . 6,669 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,669

-

-

-

-

TME

Poland . 96 parts In-Stock

1+ parts

-

100+ parts

$105.987

1k+ parts

-

10k+ parts

-

96

-

$105.987

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,732 parts In-Stock

1+ parts

$17.946

100+ parts

-

1k+ parts

-

10k+ parts

-

2,732

$17.946

-

-

-

Parana Technologies

USA . 1,398 parts In-Stock

1+ parts

$65.947

100+ parts

-

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1,398

$65.947

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-

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Ampacity Inc.

Singapore . 21 parts In-Stock

1+ parts

$66.630

100+ parts

-

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-

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21

$66.630

-

-

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Corphita

USA . 446 parts In-Stock

1+ parts

$70.551

100+ parts

-

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446

$70.551

-

-

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DigiPath Technology Company

USA . 369 parts In-Stock

1+ parts

$72.616

100+ parts

-

1k+ parts

-

10k+ parts

-

369

$72.616

-

-

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ChromeModa Solutions

Germany . 6,076 parts In-Stock

1+ parts

$74.098

100+ parts

$60.760

1k+ parts

-

10k+ parts

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6,076

$74.098

$60.760

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IDEA Electronic Components Group

UK . 1,055 parts In-Stock

1+ parts

$74.098

100+ parts

$70.393

1k+ parts

$66.688

10k+ parts

-

1,055

$74.098

$70.393

$66.688

-

Microchip USA

USA . 485 parts In-Stock

1+ parts

$113.560

100+ parts

$112.040

1k+ parts

$112.040

10k+ parts

$110.530

485

$113.560

$112.040

$112.040

$110.530

Lixinc

USA . 15,983 parts In-Stock

1+ parts

-

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15,983

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Kepictronics

USA . 210 parts In-Stock

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210

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Overview

Experience the power of cutting-edge technology with the Texas Instruments SM320C32PCMM50EP Digital Signal Processor. Crafted with precision and expertise, this high-quality product offers integrated cache, low power mode, and a maximum clock frequency of 50 MHz. Ideal for military-grade applications, this DSP provides exceptional performance and reliability. Elevate your projects with the advantage of advanced internal bus architecture, multiple timers, and a floating-point format. Trust in Texas Instruments to deliver top-notch solutions that meet and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product reliable for long-term use.

Integrated Cache: YES

Having integrated cache helps in improving processing speed and efficiency.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for flexibility in power supply options.

Address Bus Width: 24

A wider address bus width allows for more memory address space, enhancing data processing capabilities.

Package Shape: SQUARE

Square package shape is compact and space-saving, ideal for applications with limited space.

Bit Size: 32

32-bit architecture enables efficient processing of data and instructions.

Power Supplies (V): 5

Stable power supply at 5V ensures consistent performance and reliability.

No. of Terminals: 144

Higher number of terminals allow for more connectivity options and versatility in circuits.

Package Style (Meter): FLATPACK

Flatpack style offers a compact and low-profile package design.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage allows for energy-efficient operation.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures stability in harsh environmental conditions.

No. of External Interrupts: 4

Multiple external interrupts allow for efficient handling of external events and real-time processing.

Minimum Operating Temperature: -55 °C

Wide operating temperature range enables reliable performance in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position offers easy soldering and secure connection to the PCB.

Maximum Seated Height: 4.1 mm

Low seated height minimizes space requirements and allows for compact device design.

RAM Words: 512

Large RAM capacity allows for efficient data storage and retrieval during processing.

Width: 28 mm

Compact width dimension enables easy integration into various electronic systems.

External Data Bus Width: 32

A wide external data bus width enhances data transfer speeds and processing efficiency.

Maximum Clock Frequency: 50 MHz

High clock frequency enables fast data processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process with short time duration for reliability in manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component bonding.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for parallel processing and optimized data flow.

Length: 28 mm

Compact length dimension for easy integration and space-saving in electronic layouts.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliability and performance in harsh environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specialized IC type for efficient digital signal processing and other applications.

No. of Timers: 2

Multiple timers provide accurate timing control for various functions and operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form ensures easy soldering and reliable connection on the PCB.

Maximum Supply Current: 475 mA

High supply current capability for powering multiple components and peripherals.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance across different operating conditions.

No. of DMA Channels: 2

DMA channels for efficient data transfer and processing without involving the CPU.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact design and high-density PCB layouts.

Format: FLOATING POINT

Floating-point format for accurate and efficient numerical calculations and signal processing.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level 4 indicates low sensitivity to moisture, ensuring reliability in humid environments.

Low Power Mode: YES

Low power mode option for energy-efficient operation and extended battery life.

Barrel Shifter: YES

Barrel shifter feature for efficient data shifting and manipulation operations.

Technical Specifications

Digital Signal Processors (DSPs) SM320C32PCMM50EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

28 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

2

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

475 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

SM320C32PCMM50EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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