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SM320C31HFGM40

Texas Instruments

SM320C31HFGM40 by Texas Instruments

Texas Instruments SM320C31HFGM40 is a 32-bit DSP with 5V supply, 40MHz clock frequency, and 2K RAM words. Ideal for military applications due to -55 to 125 °C operating temp range and ceramic-metal package. Features include floating point format, low power mode, and barrel shifter for efficient signal processing.

Median Price

$347.882

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 2 parts In-Stock

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$347.882

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Vyrian

USA . 6,723 parts In-Stock

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Digiode

USA . 3,103 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 28 parts In-Stock

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One Stop Electronics

USA . 970 parts In-Stock

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$1.000

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970

$1.000

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AZTECH Wire

Italy . 512 parts In-Stock

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$6.906

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Parana Technologies

USA . 238 parts In-Stock

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$54.587

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DigiPath Technology Company

USA . 2,220 parts In-Stock

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$60.107

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$55.299

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$60.107

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Corohmni

South Africa . 846 parts In-Stock

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$61.064

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ChromeModa Solutions

Germany . 2,016 parts In-Stock

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$61.334

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$50.294

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$61.334

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IDEA Electronic Components Group

UK . 238 parts In-Stock

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$61.334

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$58.267

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$55.201

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Corphita

USA . 3,650 parts In-Stock

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Microchip USA

USA . 2,538 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments SM320C31HFGM40 digital signal processor. Crafted with precision and expertise, this high-quality DSP offers unmatched performance and reliability for a wide range of applications. From audio processing to telecommunications, this versatile chip delivers exceptional value, benefits, and advantages to customers seeking top-notch processing capabilities. Trust Texas Instruments to provide you with the tools you need to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability, making the product suitable for harsh environments.

Maximum Supply Voltage: 5.25 V

Allows for a higher supply voltage, providing flexibility in power input requirements.

Bit Size: 32

With a 32-bit architecture, the product can handle complex calculations and processing tasks effectively.

Temperature Grade: MILITARY

Designed to operate in extreme temperature conditions, making it ideal for military or outdoor applications.

Maximum Clock Frequency: 40 MHz

Capable of high-speed processing, suitable for applications requiring quick data processing and response times.

Technical Specifications

Digital Signal Processors (DSPs) SM320C31HFGM40 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CQFP-F132

Length:

24.19 mm

Low Power Mode:

YES

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Serial I/Os:

1

No. of Terminals:

132

No. of Timers:

2

On Chip Data RAM Width:

32

On Chip Program ROM Width:

0

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

TPAK132,2.0SQ,25

Package Shape:

Package Style (Meter):

FLATPACK, GUARD RING

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2K

Maximum Seated Height:

2.92 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.64 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.19 mm

Peripheral IC Type:

Trade Compliance

SM320C31HFGM40 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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