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ONET1151MRGTR

Texas Instruments

ONET1151MRGTR by Texas Instruments

ONET1151MRGTR by Texas Instruments is an ATM/SONET/SDH circuit with a package style of chip carrier, heat sink/slug, and very thin profile. It operates in industrial temperature grade range from -40°C to 100°C, supporting SDH and SONET applications. With a nominal voltage of 3.3V and max supply current of 100mA, it features a surface mount design with 16 terminals in a square package shape.

Median Price

$11.686

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,243 parts In-Stock

1+ parts

$11.686

100+ parts

$10.208

1k+ parts

$7.040

10k+ parts

-

8,243

$11.686

$10.208

$7.040

-

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$11.640

1k+ parts

$10.410

10k+ parts

$9.800

3,000

-

$11.640

$10.410

$9.800

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$14.550

1k+ parts

$13.012

10k+ parts

$12.250

3,000

-

$14.550

$13.012

$12.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,185 parts In-Stock

1+ parts

$9.291

100+ parts

-

1k+ parts

-

10k+ parts

-

1,185

$9.291

-

-

-

Vyrian

USA . 7,433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,433

-

-

-

-

DigiKey Marketplace

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,105 parts In-Stock

1+ parts

$6.761

100+ parts

-

1k+ parts

$7.426

10k+ parts

-

2,105

$6.761

-

$7.426

-

DigiPath Technology Company

USA . 1,944 parts In-Stock

1+ parts

$7.445

100+ parts

$6.849

1k+ parts

-

10k+ parts

-

1,944

$7.445

$6.849

-

-

ChromeModa Solutions

Germany . 6,161 parts In-Stock

1+ parts

$7.597

100+ parts

$6.230

1k+ parts

-

10k+ parts

-

6,161

$7.597

$6.230

-

-

IDEA Electronic Components Group

UK . 1,050 parts In-Stock

1+ parts

$7.597

100+ parts

-

1k+ parts

$6.837

10k+ parts

-

1,050

$7.597

-

$6.837

-

Corphita

USA . 1,539 parts In-Stock

1+ parts

$8.802

100+ parts

-

1k+ parts

-

10k+ parts

-

1,539

$8.802

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Overview

Experience unmatched quality and reliability with the ONET1151MRGTR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance and durability in all their products. The ONET1151MRGTR falls under the category of ATM/SONET/SDH Circuits, making it a versatile solution for a wide range of applications including SDH and SONET systems. With its compact design and advanced features, this product offers exceptional value, benefits, and advantages to customers looking for high-performance telecom ICs. Trust Texas Instruments for cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the circuits, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation of the product on circuit boards, saving time and effort.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand various environmental conditions, ensuring consistent performance.

Nominal Supply Voltage: 3.3 V

Operating at a standard nominal supply voltage of 3.3V, this product is compatible with many existing electronic systems, reducing the need for additional components.

Applications: SDH; SONET

Specifically designed for SDH and SONET applications, this product is optimized for high-speed data transmission and telecommunications networks.

Technical Specifications

ATM/SONET/SDH Circuits ONET1151MRGTR attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

100 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

ONET1151MRGTR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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