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TLK1102ERGER

Texas Instruments

TLK1102ERGER by Texas Instruments

TLK1102ERGER by Texas Instruments is a 24-terminal telecom IC with 3.3V supply voltage and 0.29mA max supply current. It supports SONET applications, operates in industrial temperature range (-40 to 100 °C), and features no-lead terminal form for surface mount assembly.

Median Price

$14.340

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 96,000 parts In-Stock

1+ parts

-

100+ parts

$13.690

1k+ parts

$12.250

10k+ parts

$11.530

96,000

-

$13.690

$12.250

$11.530

DigiKey

USA . 96,000 parts In-Stock

1+ parts

-

100+ parts

$14.990

1k+ parts

-

10k+ parts

-

96,000

-

$14.990

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 26 parts In-Stock

1+ parts

$13.590

100+ parts

-

1k+ parts

-

10k+ parts

-

26

$13.590

-

-

-

Digiode

USA . 1,743 parts In-Stock

1+ parts

$14.488

100+ parts

-

1k+ parts

-

10k+ parts

-

1,743

$14.488

-

-

-

DigiKey Marketplace

USA . 96,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

96,000

-

-

-

-

Vyrian

USA . 95,956 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

95,956

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,816 parts In-Stock

1+ parts

$5.421

100+ parts

-

1k+ parts

$6.124

10k+ parts

-

1,816

$5.421

-

$6.124

-

ChromeModa Solutions

Germany . 2,070 parts In-Stock

1+ parts

$6.091

100+ parts

$4.995

1k+ parts

-

10k+ parts

-

2,070

$6.091

$4.995

-

-

IDEA Electronic Components Group

UK . 837 parts In-Stock

1+ parts

$6.091

100+ parts

-

1k+ parts

$5.482

10k+ parts

-

837

$6.091

-

$5.482

-

Ampacity Inc.

Singapore . 95,778 parts In-Stock

1+ parts

$12.960

100+ parts

-

1k+ parts

-

10k+ parts

-

95,778

$12.960

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$13.590

100+ parts

$13.318

1k+ parts

-

10k+ parts

-

100

$13.590

$13.318

-

-

Corphita

USA . 2,972 parts In-Stock

1+ parts

$13.725

100+ parts

-

1k+ parts

-

10k+ parts

-

2,972

$13.725

-

-

-

Microchip USA

USA . 4,242 parts In-Stock

1+ parts

$40.880

100+ parts

$40.290

1k+ parts

$40.000

10k+ parts

$39.710

4,242

$40.880

$40.290

$40.000

$39.710

Glotronic Ltd.

UK . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,884 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

-

10k+ parts

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6,884

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

-

-

-

-

Kepictronics

USA . 2,648 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,648

-

-

-

-

DigiPath Technology Company

USA . 366 parts In-Stock

1+ parts

-

100+ parts

$5.492

1k+ parts

-

10k+ parts

-

366

-

$5.492

-

-

Overview

Elevate your network infrastructure with the TLK1102ERGER by Texas Instruments. Designed for ATM/SONET/SDH circuits, this innovative telecom IC supports a variety of applications such as SONET with its dual-channel capabilities. With Texas Instruments' reputation for quality and reliability, you can trust that this product delivers top performance. Experience the value of seamless connectivity and enhanced efficiency, thanks to its low power consumption and industrial-grade temperature range. Upgrade your systems today and stay ahead of the curve with the TLK1102ERGER.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the circuit, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Power Supplies (V): 3.3

Operates at a common and stable voltage level, ensuring compatibility with many systems and devices.

Maximum Operating Temperature: 100 °C

Can withstand high temperatures without compromising performance, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold conditions, providing reliability in various operating environments.

Applications: SONET

Specifically designed for SONET applications, ensuring optimal performance and compatibility within SONET networks.

Technical Specifications

ATM/SONET/SDH Circuits TLK1102ERGER attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SONET

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.29 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TLK1102ERGER Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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