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LMK04133SQ

Texas Instruments

LMK04133SQ by Texas Instruments

LMK04133SQ by Texas Instruments is a 48-terminal ATM/SONET/SDH circuit in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It supports a nominal voltage of 3.3V, with terminal pitch of 0.5mm, making it ideal for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,739 parts In-Stock

1+ parts

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4,739

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Digiode

USA . 4,420 parts In-Stock

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4,420

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Anansix

USA . 1,577 parts In-Stock

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1,577

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 183 parts In-Stock

1+ parts

$11.032

100+ parts

$1,024.447

1k+ parts

$9.928

10k+ parts

-

183

$11.032

$1,024.447

$9.928

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DigiPath Technology Company

USA . 2,007 parts In-Stock

1+ parts

$12.147

100+ parts

$11.175

1k+ parts

-

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2,007

$12.147

$11.175

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IDEA Electronic Components Group

UK . 2,087 parts In-Stock

1+ parts

$12.395

100+ parts

$11.775

1k+ parts

$11.156

10k+ parts

-

2,087

$12.395

$11.775

$11.156

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ChromeModa Solutions

Germany . 464 parts In-Stock

1+ parts

$12.395

100+ parts

$10.164

1k+ parts

-

10k+ parts

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464

$12.395

$10.164

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AZTECH Wire

Italy . 649 parts In-Stock

1+ parts

$16.562

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649

$16.562

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One Stop Electronics

USA . 1,204 parts In-Stock

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$956.000

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1,204

$956.000

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Corphita

USA . 4,166 parts In-Stock

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4,166

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Overview

Discover the unparalleled performance and reliability of the Texas Instruments LMK04133SQ, a cutting-edge ATM/SONET/SDH circuit designed for seamless integration in telecommunications systems. With a square package shape and 48 terminals, this surface-mount chip carrier boasts industrial-grade quality and very thin profile construction for optimal functionality in any environment. Elevate your network infrastructure with the precision engineering of Texas Instruments, delivering unmatched value and efficiency to customers seeking top-of-the-line telecom IC solutions.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards, saving time and reducing costs.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the circuit board and allows for a more organized layout of components.

No. of Terminals: 48

Having a higher number of terminals allows for more connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature means the product can operate effectively in a wide range of temperature conditions.

Terminal Position: QUAD

Quad terminal position provides stability and secure connection points for the product on the circuit board.

Width: 7 mm

The compact width of 7 mm saves space on the circuit board and allows for a more streamlined design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh industrial environments and operate reliably under tough conditions.

Nominal Supply Voltage: 3.3 V

The 3.3V supply voltage is commonly used in many electronic systems, making integration of this product easier.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density packaging and fine pitch connections, suitable for advanced electronic designs.

Technical Specifications

ATM/SONET/SDH Circuits LMK04133SQ attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LMK04133SQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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