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LMK05318BRGZR

Texas Instruments

LMK05318BRGZR by Texas Instruments

LMK05318BRGZR by Texas Instruments is a 48-terminal chip carrier with a temperature range of -40 to 85°C. It supports SDH and SONET applications, has 2 channels, and operates at a nominal voltage of 3.3V. With a low supply current of 3.465mA, this telecom IC is ideal for industrial use in ATM/SONET/SDH circuits.

Median Price

$11.351

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 27,851 parts In-Stock

1+ parts

$13.197

100+ parts

$11.528

1k+ parts

$7.950

10k+ parts

-

27,851

$13.197

$11.528

$7.950

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Chip1Stop

Japan . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$9.505

7,500

-

-

-

$9.505

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 34 parts In-Stock

1+ parts

$8.756

100+ parts

-

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-

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34

$8.756

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Digiode

USA . 4,137 parts In-Stock

1+ parts

$12.537

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-

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4,137

$12.537

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Component Sense

UK . 23,657 parts In-Stock

1+ parts

-

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23,657

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Vyrian

USA . 12,179 parts In-Stock

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12,179

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Sensible Micro Corp

USA . 200 parts In-Stock

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200

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Distributors (Availability)

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Ampacity Inc.

Singapore . 12,251 parts In-Stock

1+ parts

$8.080

100+ parts

-

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-

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12,251

$8.080

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$8.581

100+ parts

-

1k+ parts

$8.238

10k+ parts

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1,000

$8.581

-

$8.238

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Continental Prestige Electronics

USA . 4,610 parts In-Stock

1+ parts

$8.756

100+ parts

-

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10k+ parts

$8.581

4,610

$8.756

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-

$8.581

Corphita

USA . 4,197 parts In-Stock

1+ parts

$11.877

100+ parts

-

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4,197

$11.877

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Parana Technologies

USA . 327 parts In-Stock

1+ parts

$15.035

100+ parts

-

1k+ parts

$15.450

10k+ parts

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327

$15.035

-

$15.450

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ChromeModa Solutions

Germany . 5,736 parts In-Stock

1+ parts

$16.893

100+ parts

$13.852

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5,736

$16.893

$13.852

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IDEA Electronic Components Group

UK . 1,614 parts In-Stock

1+ parts

$16.893

100+ parts

$16.048

1k+ parts

$15.204

10k+ parts

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1,614

$16.893

$16.048

$15.204

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Lixinc

USA . 15,728 parts In-Stock

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15,728

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Argo Parts USA

USA . 3,467 parts In-Stock

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3,467

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A-Z Elektronik GmbH

Germany . 1,901 parts In-Stock

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1,901

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DigiPath Technology Company

USA . 1,647 parts In-Stock

1+ parts

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100+ parts

$15.231

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1,647

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$15.231

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Overview

Upgrade your network with the LMK05318BRGZR by Texas Instruments. Built by a trusted manufacturer, this ATM/SONET/SDH circuit offers high-quality performance and reliability. Ideal for SDH and SONET applications, this chip carrier with a very thin profile is designed to meet industrial standards with a wide operating temperature range. With its advanced features and no lead terminal form, this product ensures efficient operation while providing customers with exceptional value and benefits. Trust Texas Instruments to deliver cutting-edge solutions for your telecom needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to handle and resistant to damage during transportation and installation.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort in assembly processes.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions without compromising performance and reliability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with a wide range of electronic systems, making it versatile and suitable for various applications.

Technical Specifications

ATM/SONET/SDH Circuits LMK05318BRGZR attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

3.465 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

LMK05318BRGZR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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