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LMK04100SQX

Texas Instruments

LMK04100SQX by Texas Instruments

LMK04100SQX by Texas Instruments is a 48-terminal ATM/SONET/SDH circuit in a square chip carrier package. Operating temperature range from -40 to 85°C, with a nominal voltage of 3.3V. Ideal for industrial telecom applications requiring very thin profile components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,230 parts In-Stock

1+ parts

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8,230

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Digiode

USA . 3,206 parts In-Stock

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3,206

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Anansix

USA . 2,545 parts In-Stock

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2,545

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 452 parts In-Stock

1+ parts

$10.232

100+ parts

-

1k+ parts

$10.768

10k+ parts

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452

$10.232

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$10.768

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DigiPath Technology Company

USA . 1,045 parts In-Stock

1+ parts

$11.267

100+ parts

$10.366

1k+ parts

-

10k+ parts

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1,045

$11.267

$10.366

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ChromeModa Solutions

Germany . 5,640 parts In-Stock

1+ parts

$11.497

100+ parts

$9.428

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10k+ parts

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5,640

$11.497

$9.428

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IDEA Electronic Components Group

UK . 1,055 parts In-Stock

1+ parts

$11.497

100+ parts

$10.922

1k+ parts

$10.347

10k+ parts

-

1,055

$11.497

$10.922

$10.347

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AZTECH Wire

Italy . 218 parts In-Stock

1+ parts

$16.599

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218

$16.599

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One Stop Electronics

USA . 1,119 parts In-Stock

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$407.000

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1,119

$407.000

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Corphita

USA . 494 parts In-Stock

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494

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Overview

Elevate your networking systems with the advanced LMK04100SQX by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality ATM/SONET/SDH circuits that provide reliable performance and seamless connectivity. Designed for easy surface mounting, this square-shaped chip carrier boasts a very thin profile and industrial-grade temperature tolerance. With 48 terminals and a nominal supply voltage of 3.3V, the LMK04100SQX offers exceptional value, ensuring optimized functionality for your telecommunications applications. Experience superior quality and unmatched efficiency with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology ensures easy and secure installation on circuit boards, making this product convenient for assembly and maintenance.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, contributing to a compact and organized design.

No. of Terminals: 48

With a high number of terminals, this product offers a wide range of connection options and flexibility in circuit configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enables effective heat dissipation, improving overall performance and reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures stable and reliable operation even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance allows this product to function effectively in a wide range of temperature environments.

Terminal Position: QUAD

The quad terminal position provides enhanced connectivity and signal transmission capabilities, ensuring efficient data transfer in ATM/SONET/SDH circuits.

Maximum Seated Height: 0.8 mm

The low maximum seated height contributes to a slim and space-saving design, ideal for compact electronic devices and systems.

Width: 7 mm

The narrow width dimension allows for efficient placement on the circuit board, optimizing space utilization in the overall system layout.

Length: 7 mm

The compact length dimension further contributes to a space-efficient design, suitable for applications with limited board space.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade operation, this product is reliable and durable in harsh environments, ensuring long-term performance and stability.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and offers a more environmentally friendly solution for electronic assemblies.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Specifically designed for ATM/SONET/SDH circuits, this product provides optimized support and compatibility for telecom applications, ensuring seamless integration and reliable performance.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is commonly used in telecom systems, ensuring compatibility and consistent power delivery for reliable circuit operation.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5mm, this product offers precise and reliable connections, essential for high-speed data transmission in telecom applications.

Technical Specifications

ATM/SONET/SDH Circuits LMK04100SQX attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LMK04100SQX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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