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LMK04110SQX

Texas Instruments

LMK04110SQX by Texas Instruments

LMK04110SQX by Texas Instruments is a 48-terminal ATM/SONET/SDH circuit in a square chip carrier package. Operating temperature range from -40 to 85°C, with a nominal voltage of 3.3V. Ideal for industrial telecom applications requiring very thin profile components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,166 parts In-Stock

1+ parts

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4,166

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Digiode

USA . 3,051 parts In-Stock

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3,051

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Anansix

USA . 2,355 parts In-Stock

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2,355

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Distributors (Availability)

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One Stop Electronics

USA . 757 parts In-Stock

1+ parts

$10.000

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757

$10.000

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Parana Technologies

USA . 2,200 parts In-Stock

1+ parts

$10.379

100+ parts

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$10.894

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2,200

$10.379

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$10.894

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ChromeModa Solutions

Germany . 3,786 parts In-Stock

1+ parts

$11.662

100+ parts

$9.563

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3,786

$11.662

$9.563

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IDEA Electronic Components Group

UK . 1,303 parts In-Stock

1+ parts

$11.662

100+ parts

$11.079

1k+ parts

$10.496

10k+ parts

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1,303

$11.662

$11.079

$10.496

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AZTECH Wire

Italy . 582 parts In-Stock

1+ parts

$18.364

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582

$18.364

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Corphita

USA . 2,843 parts In-Stock

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2,843

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DigiPath Technology Company

USA . 209 parts In-Stock

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$10.514

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209

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$10.514

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Overview

Experience cutting-edge technology with the LMK04110SQX by Texas Instruments, a top-of-the-line ATM/SONET/SDH circuit designed to exceed your expectations. With a manufacturer known for superior quality and reliability, this surface mount chip carrier offers unmatched performance in a compact square package. Ideal for telecom applications, this industrial-grade circuit supports ATM/SONET/SDH networks with ease. Trust in Texas Instruments to deliver excellence, value, and innovation with the LMK04110SQX. Elevate your projects and stay ahead of the curve with this game-changing product.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort in the assembly process.

Package Shape: SQUARE

Square shape helps in efficient space utilization on the circuit board, optimizing the layout and potentially reducing overall product size.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for various components and external connections, enhancing the versatility of the product.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers good thermal management with the heat sink/slug design and a compact form factor due to the very thin profile, ensuring optimal performance in a limited space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance allows the product to withstand harsh environmental conditions and maintain stable performance even under elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product remains functional in cold environments, increasing its reliability in a variety of operating conditions.

Terminal Position: QUAD

Quad terminal positioning facilitates efficient connection and soldering processes, contributing to the overall reliability and durability of the product.

Maximum Seated Height: 0.8 mm

The low maximum seated height helps in achieving a compact and slim profile for the product, ideal for space-constrained applications.

Width: 7 mm

The moderate width of 7mm strikes a balance between space efficiency and ease of handling during installation and maintenance tasks.

Length: 7 mm

The compact length of 7mm further enhances the space-saving benefits of the product, making it suitable for small form factor designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in a wide range of temperature conditions typically encountered in industrial environments.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental standards and regulations, making the product eco-friendly and suitable for lead-free manufacturing processes.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

The specific telecom IC type indicates that the product is designed to support advanced communication technologies such as ATM, SONET, and SDH, ensuring compatibility and performance in telecom applications.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage offers compatibility with common power sources and ensures stable operation of the product within standard voltage ranges.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density integration of components on the circuit board, maximizing connectivity and functionality in a limited space.

Technical Specifications

ATM/SONET/SDH Circuits LMK04110SQX attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LMK04110SQX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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