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TLK1102ERGET

Texas Instruments

TLK1102ERGET by Texas Instruments

TLK1102ERGET by Texas Instruments is a telecom IC type circuit designed for SONET applications. It has 2 channels and operates at a nominal voltage of 3.3V. With a package style of chip carrier, heat sink/slug, and very thin profile, it offers compact and efficient performance.

Median Price

$21.535

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 250 parts In-Stock

1+ parts

$6.544

100+ parts

$6.231

1k+ parts

$6.127

10k+ parts

-

250

$6.544

$6.231

$6.127

-

Chip1Stop

Japan . 250 parts In-Stock

1+ parts

$16.100

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$16.100

-

-

-

Texas Instruments

USA . 18,720 parts In-Stock

1+ parts

$21.535

100+ parts

$18.811

1k+ parts

$12.973

10k+ parts

-

18,720

$21.535

$18.811

$12.973

-

Mouser Electronics

USA . 85 parts In-Stock

1+ parts

$29.870

100+ parts

$21.110

1k+ parts

$17.550

10k+ parts

-

85

$29.870

$21.110

$17.550

-

Rochester

USA . 51,487 parts In-Stock

1+ parts

-

100+ parts

$21.030

1k+ parts

$18.820

10k+ parts

$17.710

51,487

-

$21.030

$18.820

$17.710

DigiKey

USA . 51,487 parts In-Stock

1+ parts

-

100+ parts

$27.680

1k+ parts

-

10k+ parts

-

51,487

-

$27.680

-

-

Verical

USA . 41,903 parts In-Stock

1+ parts

-

100+ parts

$26.288

1k+ parts

$23.525

10k+ parts

$22.137

41,903

-

$26.288

$23.525

$22.137

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,469 parts In-Stock

1+ parts

$11.960

100+ parts

-

1k+ parts

-

10k+ parts

-

3,469

$11.960

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$16.970

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$16.970

-

-

-

DigiKey Marketplace

USA . 55,439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

55,439

-

-

-

-

Vyrian

USA . 17,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,676

-

-

-

-

EPE Components Inc.

USA . 230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

230

-

-

-

-

Bristol Electronics

USA . 230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

230

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 17,692 parts In-Stock

1+ parts

$5.560

100+ parts

-

1k+ parts

-

10k+ parts

-

17,692

$5.560

-

-

-

Corphita

USA . 3,797 parts In-Stock

1+ parts

$11.331

100+ parts

-

1k+ parts

-

10k+ parts

-

3,797

$11.331

-

-

-

Parana Technologies

USA . 1,132 parts In-Stock

1+ parts

$15.661

100+ parts

-

1k+ parts

$16.030

10k+ parts

-

1,132

$15.661

-

$16.030

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$16.631

100+ parts

-

1k+ parts

$15.965

10k+ parts

-

50

$16.631

-

$15.965

-

DigiPath Technology Company

USA . 2,131 parts In-Stock

1+ parts

$17.245

100+ parts

$15.865

1k+ parts

-

10k+ parts

-

2,131

$17.245

$15.865

-

-

IDEA Electronic Components Group

UK . 1,469 parts In-Stock

1+ parts

$17.597

100+ parts

$16.717

1k+ parts

$15.837

10k+ parts

-

1,469

$17.597

$16.717

$15.837

-

ChromeModa Solutions

Germany . 582 parts In-Stock

1+ parts

$17.597

100+ parts

$14.430

1k+ parts

-

10k+ parts

-

582

$17.597

$14.430

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 20,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,550

-

-

-

-

Kepictronics

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Overview

Discover the TLK1102ERGET by Texas Instruments, a top-quality product that brings unmatched value to your applications. As a leading manufacturer in the industry, Texas Instruments delivers exceptional performance and reliability. This innovative ATM/SONET/SDH circuit offers two channels and operates at a nominal supply voltage of 3.3V, making it perfect for telecom applications. With its compact size, robust design, and advanced features, the TLK1102ERGET guarantees seamless connectivity and outstanding results. Upgrade your projects with this cutting-edge solution and experience the advantages it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and resistance to heat and moisture, making it a reliable choice for various environments.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into different circuit boards and systems, enhancing convenience and reducing assembly time.

No. of Functions: 1

With a single function, this ATM/SONET/SDH support circuit simplifies the design and implementation process, making it cost-effective and efficient.

Package Shape: SQUARE

The square package shape allows for easy placement and efficient utilization of space in circuit board layouts, optimizing the design and enhancing overall performance.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with commonly available power sources and promotes energy efficiency, making it suitable for various applications.

No. of Terminals: 24

The 24 terminals provide connectivity options and allow for the support of multiple inputs and outputs, enabling versatile functionality in complex circuitry.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style, combined with a heat sink/slug and very thin profile, enhances heat dissipation and space-saving capabilities, making it ideal for compact designs.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this product ensures reliability and stable performance even in demanding conditions, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures versatility and adaptability, making this product suitable for a wide range of applications and environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold for terminal finish enhances conductivity, prevents corrosion, and ensures reliable electrical connections, contributing to the overall longevity and performance of the product.

Terminal Position: QUAD

The quad terminal position provides stability and secure connections, reducing the risk of signal loss or disconnection, thereby enhancing the overall reliability of the product.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this product offers a low-profile design, allowing for efficient usage of space in circuit board layouts and enabling compact system designs.

Width: 4 mm

With a width of 4 mm, this product offers a compact form factor, providing flexibility in space-constrained applications and enabling efficient integration into various systems.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand a maximum time of 30 seconds at peak reflow temperature ensures reliable soldering during assembly processes, enabling easy and secure integration into circuit boards.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures compatibility with standard reflow soldering processes, simplifying assembly and ensuring proper solder joint formation for increased reliability.

Length: 4 mm

With a length of 4 mm, this product offers a compact size, providing flexibility in design and allowing for efficient utilization of space in circuit board layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments, making this product suitable for various industrial applications that require extended temperature ranges.

Applications: SONET

Designed specifically for SONET applications, this product provides specialized features and functionalities tailored to meet the requirements of SONET-based circuitry, ensuring optimal performance and compatibility.

No. of Channels: 2

With two channels, this ATM/SONET/SDH support circuit offers the capability to support multiple data streams simultaneously, enhancing flexibility and enabling efficient data transmission.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the need for lead-based soldering processes, enhancing environmental friendliness and ensuring compliance with lead-free manufacturing regulations.

Maximum Supply Current: 0.29 mA

With a maximum supply current of 0.29 mA, this product operates with low power consumption, making it suitable for energy-efficient designs and battery-powered applications.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Specifically designed as an ATM/SONET/SDH support circuit, this product offers advanced features and functionalities required for telecommunications applications, ensuring reliable and efficient data transmission.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with common power sources, simplifying integration and providing convenient power options for various systems.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this product offers precise and closely spaced terminals, enabling compact circuit designs and promoting efficient connectivity.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this product can withstand exposure to moderate levels of moisture during storage and assembly processes, ensuring long-term reliability in typical operating conditions.

Technical Specifications

ATM/SONET/SDH Circuits TLK1102ERGET attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SONET

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.29 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TLK1102ERGET Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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