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SLK2511BPZPG4

Texas Instruments

SLK2511BPZPG4 by Texas Instruments

SLK2511BPZPG4 by Texas Instruments is a CMOS ATM/SONET/SDH transceiver with 100 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 2.5V. Ideal for SDH and SONET applications due to its fine pitch and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,984

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-

-

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Vyrian

USA . 3,265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,265

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 509 parts In-Stock

1+ parts

$14.212

100+ parts

-

1k+ parts

$14.664

10k+ parts

-

509

$14.212

-

$14.664

-

DigiPath Technology Company

USA . 801 parts In-Stock

1+ parts

$15.649

100+ parts

$14.397

1k+ parts

-

10k+ parts

-

801

$15.649

$14.397

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-

ChromeModa Solutions

Germany . 6,621 parts In-Stock

1+ parts

$15.968

100+ parts

$13.094

1k+ parts

-

10k+ parts

-

6,621

$15.968

$13.094

-

-

IDEA Electronic Components Group

UK . 986 parts In-Stock

1+ parts

$15.968

100+ parts

$15.170

1k+ parts

$14.371

10k+ parts

-

986

$15.968

$15.170

$14.371

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AZTECH Wire

Italy . 673 parts In-Stock

1+ parts

$17.035

100+ parts

-

1k+ parts

-

10k+ parts

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673

$17.035

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-

-

One Stop Electronics

USA . 1,456 parts In-Stock

1+ parts

$421.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,456

$421.000

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Corphita

USA . 2,177 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,177

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Overview

Enhance your network infrastructure with the cutting-edge SLK2511BPZPG4 by Texas Instruments. This high-quality ATM/SONET/SDH circuit offers unparalleled reliability and performance, making it the perfect choice for SDH and SONET applications. Designed with precision and expertise, this product boasts a wide range of advantages including a compact package body, low power consumption, and industrial-grade temperature tolerance. Elevate your telecom systems with the value and benefits that only Texas Instruments can deliver. Trust in the SLK2511BPZPG4 to take your network to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly processes, saving time and effort.

Power Supplies (V): 2.5

The 2.5V power supply ensures compatibility with a wide range of systems and applications.

No. of Terminals: 100

With a high number of terminals, this product can support complex circuitry and connectivity requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability even in demanding industrial environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

Applications: SDH; SONET

Designed specifically for SDH and SONET applications, ensuring compatibility and optimal performance in telecommunications networks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V is ideal for ensuring stable and consistent performance.

Technical Specifications

ATM/SONET/SDH Circuits SLK2511BPZPG4 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SLK2511BPZPG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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