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SLK2511APZP

Texas Instruments

SLK2511APZP by Texas Instruments

SLK2511APZP by Texas Instruments is an ATM/SONET/SDH transceiver IC with 100 terminals in a square package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, GULL WING terminals, and 2.5V supply voltage for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,772 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,772

-

-

-

-

Digiode

USA . 810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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810

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,684 parts In-Stock

1+ parts

$11.033

100+ parts

-

1k+ parts

$11.494

10k+ parts

-

1,684

$11.033

-

$11.494

-

ChromeModa Solutions

Germany . 1,653 parts In-Stock

1+ parts

$12.397

100+ parts

$10.166

1k+ parts

-

10k+ parts

-

1,653

$12.397

$10.166

-

-

IDEA Electronic Components Group

UK . 679 parts In-Stock

1+ parts

$12.397

100+ parts

$11.777

1k+ parts

$11.157

10k+ parts

-

679

$12.397

$11.777

$11.157

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AZTECH Wire

Italy . 848 parts In-Stock

1+ parts

$18.082

100+ parts

-

1k+ parts

-

10k+ parts

-

848

$18.082

-

-

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One Stop Electronics

USA . 974 parts In-Stock

1+ parts

$295.000

100+ parts

-

1k+ parts

-

10k+ parts

-

974

$295.000

-

-

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Corphita

USA . 4,336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,336

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-

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DigiPath Technology Company

USA . 2,089 parts In-Stock

1+ parts

-

100+ parts

$11.177

1k+ parts

-

10k+ parts

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2,089

-

$11.177

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Overview

Unlock the power of cutting-edge technology with the SLK2511APZP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that are trusted by professionals worldwide. The SLK2511APZP falls under the category of ATM/SONET/SDH Circuits, making it an essential component for telecommunications applications. With its compact design and advanced features, this product offers unmatched value, reliability, and performance to customers. Upgrade your projects with the SLK2511APZP and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and labor costs during manufacturing.

Package Shape: SQUARE

The square package shape provides a compact design, making it easy to integrate into various systems and applications.

No. of Terminals: 100

With a high number of terminals, this product can support complex circuit configurations and connectivity requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of temperature conditions, making the product versatile and adaptable.

Maximum Seated Height: 1.2 mm

The low maximum seated height helps with space constraints in compact designs, allowing for efficient use of available space on circuit boards.

Width: 14 mm

The compact width of 14 mm enables the product to be easily integrated into various board layouts, providing flexibility in design and assembly.

Length: 14 mm

The square shape and length of 14 mm contribute to a symmetrical and balanced design, enhancing stability and ease of installation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in data transmission.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V is commonly used in many electronic devices, ensuring compatibility and ease of integration with existing systems.

Technical Specifications

ATM/SONET/SDH Circuits SLK2511APZP attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

SLK2511APZP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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