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SLK2511AIPZPG4

Texas Instruments

SLK2511AIPZPG4 by Texas Instruments

SLK2511AIPZPG4 by Texas Instruments is a CMOS ATM/SONET/SDH transceiver with 100 terminals in a square package. It operates at -40 to 85°C, with a supply voltage of 2.5V and terminal pitch of 0.5mm. Ideal for SDH and SONET applications due to its industrial temperature grade and telecom IC type.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,803 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,803

-

-

-

-

Digiode

USA . 3,387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,387

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 247 parts In-Stock

1+ parts

$10.603

100+ parts

-

1k+ parts

$11.102

10k+ parts

-

247

$10.603

-

$11.102

-

ChromeModa Solutions

Germany . 4,725 parts In-Stock

1+ parts

$11.913

100+ parts

$9.769

1k+ parts

-

10k+ parts

-

4,725

$11.913

$9.769

-

-

IDEA Electronic Components Group

UK . 1,336 parts In-Stock

1+ parts

$11.913

100+ parts

$11.317

1k+ parts

$10.722

10k+ parts

-

1,336

$11.913

$11.317

$10.722

-

AZTECH Wire

Italy . 719 parts In-Stock

1+ parts

$17.203

100+ parts

-

1k+ parts

-

10k+ parts

-

719

$17.203

-

-

-

One Stop Electronics

USA . 981 parts In-Stock

1+ parts

$413.000

100+ parts

-

1k+ parts

-

10k+ parts

-

981

$413.000

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-

-

Corphita

USA . 4,116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,116

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-

-

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DigiPath Technology Company

USA . 2,349 parts In-Stock

1+ parts

-

100+ parts

$10.741

1k+ parts

-

10k+ parts

-

2,349

-

$10.741

-

-

Overview

Experience superior quality and reliability with the SLK2511AIPZPG4 by Texas Instruments, a leading manufacturer in the industry. Designed for ATM/SONET/SDH circuits, this innovative product offers unmatched performance and versatility for a wide range of applications such as SDH and SONET. With a durable plastic/epoxy package body material and advanced CMOS technology, customers can trust in the value, benefits, and advantages that this telecom IC type transceiver brings to their projects. Trust Texas Instruments to deliver exceptional solutions for your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making it suitable for rugged environments and easy to handle during installation.

Surface Mount: YES

Surface mount technology allows for efficient and automated assembly processes, reducing manufacturing costs and enabling high-volume production.

Power Supplies (V): 2.5

Operating at a low voltage of 2.5V helps to minimize power consumption and heat dissipation, ideal for energy-efficient devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh industrial environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable signal transmission over time.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital circuits, making it a versatile and efficient choice for telecom applications.

Telecom IC Type: ATM/SONET/SDH TRANSCEIVER

Designed specifically for ATM, SONET, and SDH networks, this transceiver enables high-speed data transmission and seamless connectivity in telecommunications systems.

Technical Specifications

ATM/SONET/SDH Circuits SLK2511AIPZPG4 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SLK2511AIPZPG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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