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SLK2511IPZP

Texas Instruments

SLK2511IPZP by Texas Instruments

SLK2511IPZP by Texas Instruments is an ATM/SONET/SDH transceiver with 100 terminals, operating at 2.5V. It features a temperature range of -40 to 85°C and uses CMOS technology. Ideal for SDH and SONET applications, this IC has a compact square package with GULL WING terminals.

Median Price

$58.365

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,660 parts In-Stock

1+ parts

-

100+ parts

$51.880

1k+ parts

$46.420

10k+ parts

$43.690

6,660

-

$51.880

$46.420

$43.690

DigiKey

USA . 6,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,660

-

-

-

-

Verical

USA . 2,867 parts In-Stock

1+ parts

-

100+ parts

$64.850

1k+ parts

$58.025

10k+ parts

$54.612

2,867

-

$64.850

$58.025

$54.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,454 parts In-Stock

1+ parts

$54.758

100+ parts

-

1k+ parts

-

10k+ parts

-

2,454

$54.758

-

-

-

Vyrian

USA . 2,111 parts In-Stock

1+ parts

$57.640

100+ parts

-

1k+ parts

-

10k+ parts

-

2,111

$57.640

-

-

-

DigiKey Marketplace

USA . 6,660 parts In-Stock

1+ parts

$59.950

100+ parts

-

1k+ parts

-

10k+ parts

-

6,660

$59.950

-

-

-

Semi Source

USA . 854 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

854

-

-

-

-

Bristol Electronics

USA . 53 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

53

-

-

-

-

ComSIT Distribution GmbH

Germany . 35 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35

-

-

-

-

ComSIT USA

USA . 35 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35

-

-

-

-

Sogenti Electronics

Canada . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 400 parts In-Stock

1+ parts

$7.469

100+ parts

-

1k+ parts

$7.959

10k+ parts

-

400

$7.469

-

$7.959

-

DigiPath Technology Company

USA . 1,684 parts In-Stock

1+ parts

$8.224

100+ parts

$7.566

1k+ parts

-

10k+ parts

-

1,684

$8.224

$7.566

-

-

ChromeModa Solutions

Germany . 4,481 parts In-Stock

1+ parts

$8.392

100+ parts

$6.881

1k+ parts

-

10k+ parts

-

4,481

$8.392

$6.881

-

-

IDEA Electronic Components Group

UK . 1,440 parts In-Stock

1+ parts

$8.392

100+ parts

$7.972

1k+ parts

$7.553

10k+ parts

-

1,440

$8.392

$7.972

$7.553

-

Corphita

USA . 1,743 parts In-Stock

1+ parts

$51.876

100+ parts

-

1k+ parts

-

10k+ parts

-

1,743

$51.876

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Microchip USA

USA . 133 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

133

-

-

-

-

Perfect Parts

USA . 66 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

66

-

-

-

-

Overview

Experience high-quality performance with the SLK2511IPZP by Texas Instruments, a leading manufacturer in the industry. This ATM/SONET/SDH circuit offers versatile applications in SDH and SONET technologies. With its innovative design and reliable construction, this product ensures seamless operation and precise functionality. Elevate your projects with the value and benefits that this cutting-edge component brings, providing customers with unparalleled advantages in their telecommunications systems. Choose Texas Instruments for superior quality and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and resistance to heat, making it suitable for a wide range of operating temperatures.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and space in the design.

Package Shape: SQUARE

Helps in efficient use of space on the circuit board.

Power Supplies (V): 2.5

Operates at a standard voltage level, making it compatible with common power sources.

No. of Terminals: 100

Provides sufficient connectivity options for complex circuitry and signal processing.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Offers versatile mounting options to suit different design requirements.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures without performance degradation, ensuring reliability in various environments.

Minimum Operating Temperature: -40 °C

Capable of operating in cold temperatures, making it suitable for a wide range of industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Facilitates easy connection to other components on the circuit board.

Maximum Seated Height: 1.2 mm

Compact size allows for efficient use of space in the overall system design.

Width: 14 mm

Sufficient width for accommodating the required terminals and components for the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for optimal reflow soldering process during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for proper soldering of terminals onto the circuit board.

Length: 14 mm

Balanced length with width for a compact and efficient form factor.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where there are varying temperature conditions.

Applications: SDH; SONET

Designed specifically for SDH and SONET applications, ensuring compatibility and performance.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and stability during installation and operation.

Telecom IC Type: ATM/SONET/SDH TRANSCEIVER

Specifically designed for telecom applications requiring ATM, SONET, and SDH transceiver functionality.

Nominal Supply Voltage: 2.5 V

Operates at a nominal voltage for easy integration with existing systems and circuits.

Terminal Pitch: 0.5 mm

Offers fine terminal pitch for precise connections and signal routing.

Moisture Sensitivity Level (MSL): 3

With MSL 3 rating, the product can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

ATM/SONET/SDH Circuits SLK2511IPZP attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SLK2511IPZP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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