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MAX3272AETP+

Analog Devices

MAX3272AETP+ by Analog Devices

Analog Devices' MAX3272AETP+ is a 3.3V telecom IC for ATM/SONET/SDH circuits, with 20 terminals in a square chip carrier package. Operating b/w -40 °C to 85°C, it supports applications like ATM, SDH, and SONET using bipolar technology. With a max supply current of 0.044 mA, it features matte tin terminal finish and quad terminal position.

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MAX3272AETP+ by Analog Devices
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Analog Devices Inc

USA . 249 parts In-Stock

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Vyrian

USA . 3,562 parts In-Stock

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QIE Inc.

USA . 2,336 parts In-Stock

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Anansix

USA . 1,525 parts In-Stock

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Digiode

USA . 1,049 parts In-Stock

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Rebound Electronics

UK . 72 parts In-Stock

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Semtec, LLC

USA . 41 parts In-Stock

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ACDS - Activité Composants Distribution Service

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R&J Components

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MARBEL Systems

Belgium . 45 parts In-Stock

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Texas Native Microelectronics

USA . 4,200 parts In-Stock

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$7.478

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$7.179

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$6.955

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$6.581

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Kenton Components

USA . 915 parts In-Stock

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Qasali Group International

UK . 2,452 parts In-Stock

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Component Stockers USA

USA . 684 parts In-Stock

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Semicontronic

India . 10 parts In-Stock

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Perfect Parts

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Corphita

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Microchip USA

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Glotronic Ltd.

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Authorized Procurement Solutions

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Overview

Elevate your telecom system with the MAX3272AETP+ by Analog Devices, a top-tier ATM/SONET/SDH circuit that delivers unparalleled performance and reliability. With a prestigious manufacturer like Analog Devices behind it, this square-shaped, surface-mount chip carrier offers exceptional value and benefits to customers in need of cutting-edge technology. Ideal for applications in ATM, SDH, and SONET systems, this industrial-grade circuit boasts a wide temperature range, low power consumption, and a compact design for seamless integration into your projects. Upgrade to the MAX3272AETP+ today and experience the difference in quality and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing costs.

Package Shape: SQUARE

The square package shape provides a compact and uniform design, making it suitable for space-constrained applications.

Power Supplies (V): 3.3

Operating at a low voltage of 3.3V helps in reducing power consumption and heat dissipation.

No. of Terminals: 20

Having 20 terminals allows for connectivity to multiple components, enhancing functionality and compatibility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design provides efficient heat dissipation and space-saving attributes.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand elevated temperatures without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable operation even in extreme environmental conditions.

Terminal Finish: MATTE TIN

The matte tin finish offers good solderability and corrosion resistance, ensuring long-term reliability.

Applications: ATM; SDH; SONET

Supporting ATM, SDH, and SONET applications indicates versatility and compatibility with various networking technologies.

Technology: BIPOLAR

The bipolar technology used in the product provides high-speed performance and reliability for telecommunications applications.

Nominal Supply Voltage: 3.3 V

Operating at the nominal supply voltage of 3.3V ensures consistent and stable performance in the intended applications.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Being specifically designed for ATM, SONET, and SDH support circuits, this product offers optimized functionality for telecom applications.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5mm, the product enables high-density packaging and efficient signal transmission.

Technical Specifications

ATM/SONET/SDH Circuits MAX3272AETP+ attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

ATM; SDH; SONET

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.044 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

MAX3272AETP+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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