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MAX3272EGP-T

Analog Devices

MAX3272EGP-T by Analog Devices

Analog Devices' MAX3272EGP-T is a 20-terminal ATM/SONET/SDH circuit in a square chip carrier package. Operating temperature range from -40 to 85 °C, with nominal voltage of 3.3V. Ideal for industrial telecom applications requiring very thin profile and quad terminal position.

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3

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1k+

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Vyrian

USA . 7,453 parts In-Stock

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Digiode

USA . 941 parts In-Stock

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Anansix

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AZTECH Wire

Italy . 623 parts In-Stock

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$12.638

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MARBEL Systems

Belgium . 22,477 parts In-Stock

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$12.747

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Texas Native Microelectronics

USA . 7,216 parts In-Stock

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$14.652

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$14.066

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$13.626

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$12.894

7,216

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$14.066

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$12.894

Kenton Components

USA . 50 parts In-Stock

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$17.582

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$15.473

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Qasali Group International

UK . 450 parts In-Stock

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$39.560

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Semicontronic

India . 1,389 parts In-Stock

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$50.000

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$48.750

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$48.500

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One Stop Electronics

USA . 2,551 parts In-Stock

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Corphita

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Overview

Unlock the power of high-quality telecom ICs with the MAX3272EGP-T by Analog Devices. Designed for ATM/SONET/SDH circuits, this surface mount chip carrier boasts a very thin profile and operates seamlessly in industrial settings. With a nominal supply voltage of 3.3V, this innovative technology offers unparalleled performance and reliability for a wide range of applications. Trust Analog Devices to deliver cutting-edge solutions that exceed expectations. Elevate your projects with the MAX3272EGP-T and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto a circuit board, saving space and streamlining the manufacturing process.

Package Shape: SQUARE

The square shape of the package provides a compact footprint, making it ideal for applications where space is limited.

No. of Terminals: 20

With 20 terminals, this product offers versatility and compatibility with various circuit board designs and configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances thermal management and overall performance of the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions and applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, ensuring secure connections during assembly.

Terminal Position: QUAD

The quad terminal position offers increased stability and robustness in connecting the product to the circuit board.

Maximum Seated Height: 1 mm

The low maximum seated height helps in achieving a slim profile and compact design for space-constrained applications.

Width: 4 mm

The small width dimension contributes to the overall compactness and efficiency of the product in installation and integration.

Length: 4 mm

The short length dimension further enhances the space-saving capabilities of the product, making it suitable for tight layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation and performance in demanding industrial environments.

Technology: BIPOLAR

Bipolar technology offers high-speed operation and precise signal control, making this product suitable for ATM/SONET/SDH circuits.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination and provides a more environmentally friendly solution.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Designed specifically for ATM/SONET/SDH circuits, this product offers optimal performance and compatibility in telecommunications applications.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage is commonly used in telecom applications, ensuring compatibility and efficient power consumption.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for precise and secure connections, facilitating reliable operation in high-speed telecom circuits.

Technical Specifications

ATM/SONET/SDH Circuits MAX3272EGP-T attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

MAX3272EGP-T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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