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ADN2819XCP-RL

Analog Devices

ADN2819XCP-RL by Analog Devices

ADN2819XCP-RL by Analog Devices is a 48-terminal ATM/SONET/SDH clock recovery circuit in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications like SDH and SONET. It has a nominal voltage of 3.3V and terminal pitch of 0.5mm, making it ideal for telecom systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,212 parts In-Stock

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Digiode

USA . 504 parts In-Stock

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AZTECH Wire

Italy . 874 parts In-Stock

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$6.926

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$6.926

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Parana Technologies

USA . 635 parts In-Stock

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$10.392

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$9.664

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635

$10.392

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IDEA Electronic Components Group

UK . 1,431 parts In-Stock

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$11.174

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$10.615

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$10.615

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DigiPath Technology Company

USA . 1,304 parts In-Stock

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$17.431

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$16.734

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$16.734

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$16.734

Native Components

USA . 609 parts In-Stock

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$44.250

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$42.480

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$42.480

Northwest PG Solutions

USA . 1,210 parts In-Stock

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$48.675

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One Stop Electronics

USA . 585 parts In-Stock

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$407.000

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Semicontronic

India . 681 parts In-Stock

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$845.000

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$823.875

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$819.650

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Corphita

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Overview

Enhance your telecom systems with the cutting-edge ADN2819XCP-RL by Analog Devices. This ATM/SONET/SDH Clock Recovery Circuit boasts top-notch quality and reliability, thanks to the renowned manufacturer. Ideal for SDH and SONET applications, this surface-mountable chip carrier offers a compact design with 48 terminals, ensuring seamless integration into your devices. With an industrial temperature grade and nominal supply voltage of 3.3V, customers can trust in the superior performance and efficiency of this innovative product. Experience increased productivity and enhanced functionality with the ADN2819XCP-RL, setting new standards in the industry.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making installation and maintenance easier for production.

Package Shape: SQUARE

Square package shape provides stability and ease of handling during the manufacturing process and when integrating the component into the system.

No. of Terminals: 48

With 48 terminals, this product offers a high level of connectivity and functionality, making it suitable for complex networking applications.

Package Style: CHIP CARRIER, VERY THIN PROFILE

The chip carrier style with a very thin profile allows for space-saving design and integration in compact devices where size is a constraint.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product is capable of operating reliably in harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the product can function across a wide range of temperature conditions, making it versatile for various deployment environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides excellent solderability and reliability in the assembly process, enhancing the product's overall durability and performance.

Maximum Seated Height: 0.9 mm

The low maximum seated height of 0.9mm allows for a slim profile and compact design, ideal for applications requiring space efficiency.

Width: 7 mm

The 7mm width offers a balance between space-saving design and functionality, making it suitable for various circuit board layouts and integration requirements.

Length: 7 mm

The 7mm length complements the compact width, allowing for a square shape that enhances stability and ease of integration into the system.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh industrial environments, making it reliable for mission-critical applications in industrial settings.

Applications: SDH; SONET

Designed for SDH and SONET applications, this product is optimized for high-speed telecom networks, ensuring compatibility and performance in demanding networking environments.

Terminal Form: NO LEAD

No lead terminal form provides a lead-free option for environmentally conscious designs and complies with regulations, making it a sustainable choice for modern electronics manufacturing.

Telecom IC Type: ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

Specifically designed for ATM, SONET, and SDH networks, this clock recovery circuit ensures precise synchronization and timing accuracy, critical for maintaining reliable data transmission in telecommunications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, this product offers power efficiency and compatibility with standard voltage requirements in telecom equipment, ensuring seamless integration and reliable performance.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides high-density packaging and connectivity, allowing for more terminals in a compact space, ideal for advanced networking applications that require efficient signal routing.

Technical Specifications

ATM/SONET/SDH Circuits ADN2819XCP-RL attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e0

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADN2819XCP-RL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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