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ONET2804TY

Texas Instruments

ONET2804TY by Texas Instruments

ONET2804TY by Texas Instruments is an ATM/SONET/SDH support circuit with 76 terminals, operating b/w -40°C to 100°C. It has a package style of unencased chip and supports a nominal voltage of 3.3V. This telecom IC is designed for surface mount applications in industrial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,300

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-

-

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Digiode

USA . 1,049 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,049

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,301 parts In-Stock

1+ parts

$7.085

100+ parts

-

1k+ parts

$7.614

10k+ parts

-

1,301

$7.085

-

$7.614

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DigiPath Technology Company

USA . 1,113 parts In-Stock

1+ parts

$7.802

100+ parts

-

1k+ parts

-

10k+ parts

-

1,113

$7.802

-

-

-

ChromeModa Solutions

Germany . 5,210 parts In-Stock

1+ parts

$7.961

100+ parts

$6.528

1k+ parts

-

10k+ parts

-

5,210

$7.961

$6.528

-

-

IDEA Electronic Components Group

UK . 1,953 parts In-Stock

1+ parts

$7.961

100+ parts

-

1k+ parts

$7.165

10k+ parts

-

1,953

$7.961

-

$7.165

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AZTECH Wire

Italy . 655 parts In-Stock

1+ parts

$13.521

100+ parts

-

1k+ parts

-

10k+ parts

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655

$13.521

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Microchip USA

USA . 2,572 parts In-Stock

1+ parts

$94.850

100+ parts

$93.210

1k+ parts

$92.380

10k+ parts

$91.560

2,572

$94.850

$93.210

$92.380

$91.560

One Stop Electronics

USA . 786 parts In-Stock

1+ parts

$606.000

100+ parts

-

1k+ parts

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10k+ parts

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786

$606.000

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Corphita

USA . 411 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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411

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Overview

Enhance your telecom systems with the ONET2804TY by Texas Instruments, a top-quality ATM/SONET/SDH circuit designed for optimal performance in industrial settings. With its surface mount technology and compact rectangular shape, this chip offers seamless integration and reliable operation in a variety of applications. Trust in the renowned expertise of Texas Instruments to deliver superior telecom ICs that exceed expectations. Elevate your communication networks with the value and benefits of the ONET2804TY, providing efficiency and precision where it matters most.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape is commonly used in electronic components, making it compatible with various devices and circuit layouts.

No. of Terminals: 76

Sufficient number of terminals for connectivity and functionality in complex circuit applications.

Package Style: UNCASED CHIP

Uncased chip design provides flexibility for custom enclosures, allowing for optimized performance and heat dissipation.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliability and stability in harsh environments or extended usage.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in various climatic conditions, enhancing versatility and durability.

Width: 1.45 mm

Compact width enables integration into space-constrained applications without sacrificing performance or functionality.

Length: 3.25 mm

Optimal length for fitting into standard size electronic assemblies while maintaining a streamlined design.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed for rugged environments with reliable performance under demanding conditions.

Nominal Supply Voltage: 3.3 V

Common voltage specification for seamless integration with existing systems, ensuring compatibility and ease of use.

Technical Specifications

ATM/SONET/SDH Circuits ONET2804TY attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Additional Features:

Data rate is 28 Gbps

JESD-30 Code:

R-XUUC-N

Length:

3.25 mm

No. of Functions:

1

No. of Terminals:

76

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.45 mm

Trade Compliance

ONET2804TY Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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