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TNETA1500PCM

Texas Instruments

TNETA1500PCM by Texas Instruments

TNETA1500PCM by Texas Instruments is an ATM/SONET/SDH transceiver with BICMOS technology. It operates at 5V, has 144 terminals in a square package, and supports applications like ATM, SDH, and SONET. The IC has a max supply current of 180mA and can withstand temperatures from 0 to 70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,739 parts In-Stock

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Digiode

USA . 2,736 parts In-Stock

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Electronic Expediters

USA . 20 parts In-Stock

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R&J Components

USA . 19 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 10 parts In-Stock

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Sea View Technologies

USA . 6 parts In-Stock

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Bristol Electronics

USA . 6 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,206 parts In-Stock

1+ parts

$10.837

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$11.316

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$10.837

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$11.316

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ChromeModa Solutions

Germany . 5,494 parts In-Stock

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$12.176

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$9.984

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$12.176

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IDEA Electronic Components Group

UK . 1,720 parts In-Stock

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$12.176

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$11.567

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$10.958

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$12.176

$11.567

$10.958

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AZTECH Wire

Italy . 719 parts In-Stock

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$16.302

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One Stop Electronics

USA . 325 parts In-Stock

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$762.000

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A-Z Elektronik GmbH

Germany . 5,696 parts In-Stock

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Corphita

USA . 3,390 parts In-Stock

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DigiPath Technology Company

USA . 1,511 parts In-Stock

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$10.978

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$10.978

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Experience seamless and reliable data transmission with the TNETA1500PCM by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality ATM/SONET/SDH Circuits that are perfect for a wide range of applications including ATM, SDH, and SONET technology. With its compact design and high-performance capabilities, this product offers customers unparalleled value, efficiency, and dependability. Stay ahead of the curve with Texas Instruments and revolutionize your networking solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product durable and resistant to environmental factors, ensuring longevity and reliability.

Surface Mount: YES

Being surface mountable allows for easy installation and compact design, making it suitable for space-constrained environments.

Package Shape: SQUARE

The square package shape provides stability and ease of mounting, making it a convenient choice for various applications.

Power Supplies (V): 5

Operates at a standard voltage of 5V, which is commonly used in many electronic systems, ensuring compatibility and ease of integration.

No. of Terminals: 144

With a high number of terminals, this product offers versatility and connectivity options for different configurations and setups.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperatures, making it suitable for various environments and applications.

Minimum Operating Temperature: 0 °C

The ability to operate at 0°C ensures reliability and functionality even in low-temperature conditions.

Terminal Position: QUAD

The quad terminal position allows for efficient and organized connectivity, facilitating easy installation and maintenance.

Maximum Seated Height: 4.1 mm

The low maximum seated height makes it suitable for compact designs and space-saving applications.

Width: 28 mm

The 28mm width provides a balanced size that is suitable for various equipment and systems.

Length: 28 mm

The 28mm length offers a compact form factor, making it ideal for applications with limited space.

Temperature Grade: COMMERCIAL

Designed for commercial temperature range, ensuring stable performance in standard operating conditions.

Applications: ATM; SDH; SONET

Compatible with ATM, SDH, and SONET applications, providing versatility and flexibility for different networking requirements.

Technology: BICMOS

Utilizes BICMOS technology for efficient power consumption and high-speed performance, making it a reliable choice for data transmission.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable connections, ensuring stable operation in various conditions.

Maximum Supply Current: 180 mA

With a maximum supply current of 180mA, it ensures efficient power usage and reliability in demanding applications.

Telecom IC Type: ATM/SONET/SDH TRANSCEIVER

As a transceiver IC for ATM, SONET, and SDH technologies, it enables seamless data transmission and communication in telecommunications networks.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility and stable operation with standard power sources.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting and efficient use of space in electronic designs.

Technical Specifications

ATM/SONET/SDH Circuits TNETA1500PCM attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

ATM; SDH; SONET

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

180 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

28 mm

Trade Compliance

TNETA1500PCM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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