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TNETA1611PCA

Texas Instruments

TNETA1611PCA by Texas Instruments

TNETA1611PCA by Texas Instruments is an ATM/SONET/SDH circuit with 100 terminals, operating at -40 to 85°C. It supports SDH and SONET applications, with a nominal voltage of 5V. The package is a square-shaped flatpack made of plastic/epoxy, suitable for industrial-grade telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,421 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,421

-

-

-

-

Digiode

USA . 1,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,435

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 222 parts In-Stock

1+ parts

$10.544

100+ parts

-

1k+ parts

$11.048

10k+ parts

-

222

$10.544

-

$11.048

-

DigiPath Technology Company

USA . 475 parts In-Stock

1+ parts

$11.610

100+ parts

$10.681

1k+ parts

-

10k+ parts

-

475

$11.610

$10.681

-

-

ChromeModa Solutions

Germany . 1,534 parts In-Stock

1+ parts

$11.847

100+ parts

$9.715

1k+ parts

-

10k+ parts

-

1,534

$11.847

$9.715

-

-

IDEA Electronic Components Group

UK . 1,489 parts In-Stock

1+ parts

$11.847

100+ parts

$11.255

1k+ parts

$10.662

10k+ parts

-

1,489

$11.847

$11.255

$10.662

-

AZTECH Wire

Italy . 634 parts In-Stock

1+ parts

$19.221

100+ parts

-

1k+ parts

-

10k+ parts

-

634

$19.221

-

-

-

One Stop Electronics

USA . 1,110 parts In-Stock

1+ parts

$873.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,110

$873.000

-

-

-

Corphita

USA . 1,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,580

-

-

-

-

Overview

Upgrade your telecom systems with the TNETA1611PCA by Texas Instruments, a cutting-edge ATM/SONET/SDH circuit offering unmatched quality and reliability. Designed by a trusted manufacturer, this product is perfect for SDH and SONET applications, providing seamless connectivity and performance. With a durable plastic/epoxy body and quad terminal position, this device ensures optimal functionality even in industrial settings. Trust Texas Instruments to deliver top-notch telecom ICs that exceed expectations. Elevate your network with the TNETA1611PCA and experience unparalleled value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the circuit, ensuring a longer lifespan.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square shape design offers a compact and space-saving form factor, making it suitable for integration in various telecom systems.

Power Supplies (V): 5

Operating at 5V makes it compatible with standard power supplies, ensuring seamless integration into existing systems.

No. of Terminals: 100

Having 100 terminals allows for a high level of connectivity and versatility in connecting to other components or systems.

Package Style (Meter): FLATPACK

Flatpack design offers a streamlined and efficient packaging solution, optimizing space utilization and ease of handling.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliable performance in various conditions.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C allows for use in cold environments without compromising functionality, making it versatile for different applications.

Terminal Position: QUAD

Quad terminal position provides stability and secure connections, reducing the risk of disconnection or signal loss.

Temperature Grade: INDUSTRIAL

Industrial grade temperature rating ensures the product can operate reliably in harsh industrial environments with fluctuating temperatures.

Applications: SDH; SONET

Compatibility with SDH and SONET applications makes it versatile and allows for integration into various telecom networks and systems.

Terminal Form: GULL WING

Gull wing terminal form offers easy soldering and secure connections, ensuring a stable electrical connection for optimal performance.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Specialized support circuit designed for ATM, SONET, and SDH applications, providing enhanced functionality and compatibility for telecom networks.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5mm allows for high-density packaging and efficient use of space on circuit boards, enabling compact designs.

Technical Specifications

ATM/SONET/SDH Circuits TNETA1611PCA attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQFP-G100

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TNETA1611PCA Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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