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TNETA1575PGC

Texas Instruments

TNETA1575PGC by Texas Instruments

TNETA1575PGC by Texas Instruments is an ATM/SONET/SDH circuit IC with 240 terminals, operating at 3.3-5V. It features a flatpack, fine pitch style and GULL WING terminal form. Ideal for ATM applications, this CMOS technology device has a temp range of 0-70°C and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,443 parts In-Stock

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Lakeland Logistics Inc

USA . 3,880 parts In-Stock

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3,880

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Bristol Electronics

USA . 3,880 parts In-Stock

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3,880

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Vyrian

USA . 2,107 parts In-Stock

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R&J Components

USA . 1,080 parts In-Stock

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Electronic Expediters

USA . 120 parts In-Stock

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120

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Lighthouse Electronics, Inc.

USA . 70 parts In-Stock

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PC Components Company LLC

USA . 51 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 49 parts In-Stock

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NPI Materials, Inc.

USA . 29 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Parana Technologies

USA . 1,884 parts In-Stock

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$10.966

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$11.428

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ChromeModa Solutions

Germany . 3,183 parts In-Stock

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$12.321

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$10.103

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$12.321

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IDEA Electronic Components Group

UK . 1,026 parts In-Stock

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$12.321

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$11.705

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$11.089

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AZTECH Wire

Italy . 679 parts In-Stock

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$17.702

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One Stop Electronics

USA . 1,058 parts In-Stock

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$843.000

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A-Z Elektronik GmbH

Germany . 6,485 parts In-Stock

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Corphita

USA . 4,090 parts In-Stock

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Kepictronics

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DigiPath Technology Company

USA . 103 parts In-Stock

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$11.109

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Discover the superior quality and reliability of Texas Instruments with the TNETA1575PGC, a cutting-edge ATM/SONET/SDH circuit designed to meet your telecommunications needs. With a focus on innovation and excellence, Texas Instruments delivers products that set industry standards. This versatile device offers customers unmatched value, providing seamless integration into a variety of applications, from ATM networks to SONET systems. Experience the benefits of advanced technology and exceptional performance with the TNETA1575PGC - the ultimate solution for your networking requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and improving overall design flexibility.

Power Supplies (V): 3.3, 5

The availability of multiple power supply options (3.3V and 5V) provides flexibility in different system configurations and power requirements.

No. of Terminals: 240

The high number of terminals (240) allows for versatile connectivity options and compatibility with various circuit configurations.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70°C ensures reliable performance even in challenging environmental conditions.

Width: 32 mm

The compact width of 32mm makes the product suitable for applications where space is limited.

Length: 32 mm

With a length of 32mm, the product maintains a small footprint, ideal for compact device designs.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high integration capabilities, contributing to energy efficiency and performance optimization.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is commonly used in digital circuits, offering compatibility with existing systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting and enhances signal integrity, making the product suitable for advanced applications.

Technical Specifications

ATM/SONET/SDH Circuits TNETA1575PGC attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

ATM

JESD-30 Code:

S-PQFP-G240

Length:

32 mm

No. of Functions:

1

No. of Terminals:

240

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP240,1.3SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

32 mm

Trade Compliance

TNETA1575PGC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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