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TNETA1575MFP

Texas Instruments

TNETA1575MFP by Texas Instruments

TNETA1575MFP by Texas Instruments is an ATM/SONET/SDH circuit with 240 terminals, operating at temperatures from 0 to 70°C. It features power supplies of 3.3V and 5V, suitable for telecom applications requiring a segmentation and reassembly device in a square package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,800 parts In-Stock

1+ parts

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6,800

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Digiode

USA . 4,905 parts In-Stock

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4,905

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 253 parts In-Stock

1+ parts

$7.561

100+ parts

-

1k+ parts

$8.074

10k+ parts

-

253

$7.561

-

$8.074

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IDEA Electronic Components Group

UK . 1,327 parts In-Stock

1+ parts

$8.496

100+ parts

$8.071

1k+ parts

$7.646

10k+ parts

-

1,327

$8.496

$8.071

$7.646

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ChromeModa Solutions

Germany . 727 parts In-Stock

1+ parts

$8.496

100+ parts

$6.967

1k+ parts

-

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727

$8.496

$6.967

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AZTECH Wire

Italy . 314 parts In-Stock

1+ parts

$19.469

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314

$19.469

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One Stop Electronics

USA . 427 parts In-Stock

1+ parts

$350.000

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427

$350.000

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Ampacity Inc.

Singapore . 639 parts In-Stock

1+ parts

$579.000

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639

$579.000

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Semicontronic

India . 915 parts In-Stock

1+ parts

$632.000

100+ parts

$616.200

1k+ parts

$613.040

10k+ parts

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915

$632.000

$616.200

$613.040

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DigiPath Technology Company

USA . 1,177 parts In-Stock

1+ parts

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100+ parts

$7.660

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1,177

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$7.660

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Corphita

USA . 481 parts In-Stock

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481

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Corohmni

South Africa . 357 parts In-Stock

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357

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Overview

Elevate your network to the next level with the TNETA1575MFP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality ATM/SONET/SDH Circuits that are versatile and reliable. This device offers seamless integration, efficient power supplies, and a wide operating temperature range, making it perfect for a variety of applications. Upgrade your network infrastructure today and experience the value and benefits that the TNETA1575MFP brings to your business. Trust Texas Instruments for cutting-edge technology that drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight construction, making it ideal for transport and installation in various environments.

Surface Mount: YES

With surface mount capability, this product can be easily integrated onto circuit boards, resulting in a compact and space-saving design.

Package Shape: SQUARE

The square package shape provides stability and uniformity in design, facilitating efficient placement and assembly within electronic systems.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages allows flexibility in power input options, catering to different system requirements and configurations.

No. of Terminals: 240

The high number of terminals enables connectivity to a wide range of devices and components, enhancing the versatility and compatibility of the product.

Package Style (Meter): FLATPACK

The flatpack package style offers a sleek and streamlined form factor, facilitating easy installation and integration into existing systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can operate reliably in various environmental conditions without risk of overheating.

Minimum Operating Temperature: 0 °C

The product's ability to operate effectively at temperatures as low as 0°C ensures reliable performance even in cold environments.

Terminal Position: QUAD

Quad terminal positioning enhances stability and connectivity, reducing the risk of signal interference or loss for improved performance.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for performance and reliability in typical operating environments.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections, ensuring reliable electrical contact and stability in demanding operational conditions.

Telecom IC Type: ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE

This product features advanced telecom IC technology for efficient data segmentation and reassembly, enabling high-speed and reliable data transmission.

Terminal Pitch: 0.5 mm

With a narrow terminal pitch of 0.5mm, this product allows for high-density mounting on circuit boards, maximizing space efficiency and component integration.

Technical Specifications

ATM/SONET/SDH Circuits TNETA1575MFP attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G240

No. of Terminals:

240

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP240,1.3SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sub-Category:

ATM/SONET/SDH ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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