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ONET1191VRGPT

Texas Instruments

ONET1191VRGPT by Texas Instruments

ONET1191VRGPT by Texas Instruments is an ATM/SONET/SDH circuit with a package style of chip carrier, heat sink/slug, and very thin profile. It operates b/w -40 to 85°C, suitable for industrial applications like SDH and SONET. With a nominal voltage of 3.3V and max supply current of 72mA, it offers high performance in telecom systems.

Median Price

$7.650

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 33,977 parts In-Stock

1+ parts

-

100+ parts

$7.630

1k+ parts

$6.830

10k+ parts

$6.420

33,977

-

$7.630

$6.830

$6.420

DigiKey

USA . 33,977 parts In-Stock

1+ parts

-

100+ parts

$7.650

1k+ parts

-

10k+ parts

-

33,977

-

$7.650

-

-

Verical

USA . 33,977 parts In-Stock

1+ parts

-

100+ parts

$9.537

1k+ parts

$8.537

10k+ parts

$8.025

33,977

-

$9.537

$8.537

$8.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,224 parts In-Stock

1+ parts

$6.992

100+ parts

-

1k+ parts

-

10k+ parts

-

2,224

$6.992

-

-

-

Vyrian

USA . 4,881 parts In-Stock

1+ parts

$7.360

100+ parts

-

1k+ parts

-

10k+ parts

-

4,881

$7.360

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,364

-

-

-

-

Cyclops Electronics Ltd

UK . 460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

460

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,894 parts In-Stock

1+ parts

$6.624

100+ parts

-

1k+ parts

-

10k+ parts

-

2,894

$6.624

-

-

-

Parana Technologies

USA . 514 parts In-Stock

1+ parts

$8.544

100+ parts

-

1k+ parts

$9.202

10k+ parts

-

514

$8.544

-

$9.202

-

DigiPath Technology Company

USA . 83 parts In-Stock

1+ parts

$9.408

100+ parts

$8.655

1k+ parts

-

10k+ parts

-

83

$9.408

$8.655

-

-

IDEA Electronic Components Group

UK . 1,235 parts In-Stock

1+ parts

$9.600

100+ parts

$9.120

1k+ parts

$8.640

10k+ parts

-

1,235

$9.600

$9.120

$8.640

-

ChromeModa Solutions

Germany . 648 parts In-Stock

1+ parts

$9.600

100+ parts

$7.872

1k+ parts

-

10k+ parts

-

648

$9.600

$7.872

-

-

Microchip USA

USA . 1,426 parts In-Stock

1+ parts

$108.860

100+ parts

$106.970

1k+ parts

$106.020

10k+ parts

$105.080

1,426

$108.860

$106.970

$106.020

$105.080

A-Z Elektronik GmbH

Germany . 5,487 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,487

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Unleash the power of connectivity with the ONET1191VRGPT by Texas Instruments. Crafted with precision and expertise, this ATM/SONET/SDH circuit offers unmatched quality and reliability. Perfect for SDH and SONET applications, this versatile product is a game-changer in the telecom industry. Providing seamless integration and cutting-edge technology, the ONET1191VRGPT ensures optimal performance and efficiency. Elevate your projects with Texas Instruments' innovative solutions and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic body material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and costs.

Package Shape: SQUARE

Square package shape provides a compact design, saving space on the PCB.

No. of Terminals: 20

Having 20 terminals allows for connectivity to multiple components or circuits, enhancing functionality.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Maximum Supply Current: 72 mA

With a maximum supply current of 72 mA, the product is efficient in power consumption, making it cost-effective.

Nominal Supply Voltage: 3.3 V

Operates at a standard supply voltage of 3.3V, compatible with most electronic systems.

Applications: SDH; SONET

Designed for SDH and SONET applications, ensuring compatibility with telecommunications networks.

Technical Specifications

ATM/SONET/SDH Circuits ONET1191VRGPT attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current:

72 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ONET1191VRGPT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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