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ONET1151PRGTT

Texas Instruments

ONET1151PRGTT by Texas Instruments

ONET1151PRGTT by Texas Instruments is a telecom IC for SDH and SONET applications. It operates at -40 to 100°C with a supply voltage of 3.3V and max current of 52mA. This chip carrier has 16 terminals, measures 3x3mm, and features Ni/Pd/Au finish.

Median Price

$5.110

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,890 parts In-Stock

1+ parts

$4.151

100+ parts

$3.384

1k+ parts

$2.256

10k+ parts

-

2,890

$4.151

$3.384

$2.256

-

Mouser Electronics

USA . 4,560 parts In-Stock

1+ parts

$6.070

100+ parts

$3.910

1k+ parts

$3.460

10k+ parts

-

4,560

$6.070

$3.910

$3.460

-

DigiKey

USA . 732 parts In-Stock

1+ parts

$6.070

100+ parts

$3.912

1k+ parts

$3.559

10k+ parts

$3.426

732

$6.070

$3.912

$3.559

$3.426

Rochester

USA . 49 parts In-Stock

1+ parts

-

100+ parts

$3.170

1k+ parts

$2.840

10k+ parts

$2.670

49

-

$3.170

$2.840

$2.670

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,830 parts In-Stock

1+ parts

$3.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,830

$3.190

-

-

-

Digiode

USA . 2,827 parts In-Stock

1+ parts

$3.354

100+ parts

-

1k+ parts

-

10k+ parts

-

2,827

$3.354

-

-

-

Chip Stock

USA . 66,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

66,450

-

-

-

-

Speed Components Ltd

Israel . 229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

229

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,967 parts In-Stock

1+ parts

$3.177

100+ parts

-

1k+ parts

-

10k+ parts

-

2,967

$3.177

-

-

-

Parana Technologies

USA . 716 parts In-Stock

1+ parts

$7.358

100+ parts

-

1k+ parts

$7.851

10k+ parts

-

716

$7.358

-

$7.851

-

DigiPath Technology Company

USA . 2,340 parts In-Stock

1+ parts

$8.102

100+ parts

$7.454

1k+ parts

-

10k+ parts

-

2,340

$8.102

$7.454

-

-

ChromeModa Solutions

Germany . 5,934 parts In-Stock

1+ parts

$8.267

100+ parts

$6.779

1k+ parts

-

10k+ parts

-

5,934

$8.267

$6.779

-

-

IDEA Electronic Components Group

UK . 1,250 parts In-Stock

1+ parts

$8.267

100+ parts

-

1k+ parts

$7.440

10k+ parts

-

1,250

$8.267

-

$7.440

-

QUARKTWIN TECHNOLOGY LTD

USA . 23,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,435

-

-

-

-

Overview

Experience seamless and reliable data transmission with the ONET1151PRGTT by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality in their products, making this ATM/SONET/SDH circuit a must-have for telecom applications. With its compact square shape and advanced technology, this chip carrier offers high performance even in extreme temperatures. Trust in the ONET1151PRGTT to optimize your network efficiency and provide unparalleled value to your business operations.

Feature Benefit Bullets

Surface Mount: YES

Surface mounting allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape provides stability and uniformity in mounting, making it suitable for applications where space utilization is critical.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities to be integrated into the circuit, making it versatile and capable of handling complex tasks.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this circuit can withstand high temperature environments without compromising performance, ensuring reliability in various operating conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this circuit suitable for use in extreme cold environments without the risk of failure or damage.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term durability and reliable performance.

Terminal Position: QUAD

Quad terminal position offers a stable and secure connection, minimizing the risk of signal loss or interference, making it ideal for high-speed data transmission in ATM/SONET/SDH applications.

Maximum Seated Height: 1 mm

Low seated height enables compact design and integration into space-constrained applications, allowing for efficient use of PCB real estate.

Width: 3 mm

With a width of 3mm, this circuit is suitable for applications where size constraints are a concern, making it a compact and space-saving solution.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this circuit can withstand high-temperature soldering processes, ensuring reliable and robust solder joints during assembly.

Length: 3 mm

The 3mm length makes this circuit suitable for applications where space is limited, offering versatility in design and placement on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions and industrial settings, making it a dependable choice for rugged applications.

Applications: SDH; SONET

Designed specifically for SDH and SONET applications, this circuit offers optimized performance and compatibility for telecommunication networks requiring high-speed data transmission.

Terminal Form: NO LEAD

The no-lead terminal form provides environmental benefits by eliminating lead content, making this circuit eco-friendly and compliant with RoHS regulations.

Maximum Supply Current: 52 mA

With a maximum supply current of 52mA, this circuit is energy-efficient and minimizes power consumption, making it suitable for battery-powered devices and applications.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

As a dedicated ATM/SONET/SDH support circuit, this product offers specialized functionality and compatibility for telecommunications equipment, ensuring seamless integration and optimal performance.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, this circuit is compatible with standard power sources and offers stable performance in telecommunication applications.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this circuit provides precise and reliable connections, ensuring signal integrity and high-speed data transmission in ATM/SONET/SDH networks.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 indicates that this circuit is less sensitive to moisture, making it suitable for use in humid environments and ensuring long-term reliability.

Technical Specifications

ATM/SONET/SDH Circuits ONET1151PRGTT attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

52 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

ONET1151PRGTT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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