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ONET1101LRGETG4

Texas Instruments

ONET1101LRGETG4 by Texas Instruments

ONET1101LRGETG4 by Texas Instruments is a 24-terminal chip carrier with a max operating temperature of 100°C. It is designed for SDH and SONET applications, supporting a nominal voltage of 3.3V and a max supply current of 118mA. This telecom IC features a surface mount package style with a terminal pitch of 0.5mm, making it suitable for high-speed network circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,279 parts In-Stock

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2,279

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Vyrian

USA . 2,216 parts In-Stock

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2,216

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,743 parts In-Stock

1+ parts

$15.473

100+ parts

-

1k+ parts

$15.856

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1,743

$15.473

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$15.856

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ChromeModa Solutions

Germany . 2,985 parts In-Stock

1+ parts

$17.385

100+ parts

$14.256

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2,985

$17.385

$14.256

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IDEA Electronic Components Group

UK . 1,888 parts In-Stock

1+ parts

$17.385

100+ parts

$16.516

1k+ parts

$15.646

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1,888

$17.385

$16.516

$15.646

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AZTECH Wire

Italy . 445 parts In-Stock

1+ parts

$18.987

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445

$18.987

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One Stop Electronics

USA . 936 parts In-Stock

1+ parts

$159.000

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936

$159.000

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Corphita

USA . 4,196 parts In-Stock

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4,196

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DigiPath Technology Company

USA . 2,238 parts In-Stock

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$15.674

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2,238

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$15.674

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Microchip USA

USA . 1,067 parts In-Stock

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1,067

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Overview

Elevate your network performance with the ONET1101LRGETG4 by Texas Instruments. Designed for ATM/SONET/SDH circuits, this cutting-edge telecom IC type offers unparalleled reliability and precision. Whether you're working on SDH or SONET applications, this product is guaranteed to deliver superior results. With a durable package body material and innovative terminal finish, Texas Instruments ensures that every detail is crafted to perfection. Experience the seamless integration of advanced technology and unmatched quality with the ONET1101LRGETG4 - your key to unlocking a new level of efficiency and effectiveness in your network operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to physical damage, making this product suitable for long-lasting usage in various environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape offers compactness and efficient use of space on the circuit board, making it ideal for designs with limited space constraints.

No. of Terminals: 24

The ample number of terminals allows for the connection of multiple components, enhancing functionality and versatility in circuit design.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand elevated thermal conditions without compromising performance, ensuring reliability in various operating environments.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature enables this product to function efficiently even in colder environments, expanding its usability in diverse temperature ranges.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish provides excellent conductivity, corrosion resistance, and reliability in electrical connections, enhancing the overall performance and longevity of the product.

Terminal Position: QUAD

Having terminals in a quad position facilitates easy connections and optimal signal transmission, contributing to the product's efficiency and performance.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a compact and slim profile, making this product suitable for space-constrained designs and applications.

Width: 4 mm

The compact width of 4 mm enables efficient placement and integration of this product in circuit board layouts, contributing to space-saving and streamlined designs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure and reliable soldering during the assembly process, maintaining the integrity and performance of the product.

Length: 4 mm

The short length of 4 mm further enhances the compactness and space efficiency of this product, making it suitable for small-scale designs and applications.

Applications: SDH; SONET

Being compatible with SDH and SONET applications showcases the product's versatility and suitability for use in high-speed telecommunications networks, ensuring seamless integration and performance.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead-related environmental hazards and assures compliance with environmental regulations, making this product an environmentally friendly choice.

Maximum Supply Current: 118 mA

With a maximum supply current of 118 mA, this product offers efficient power consumption while delivering reliable performance, making it an energy-efficient option for various applications.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

The specialized telecom IC type of ATM/SONET/SDH support circuit ensures compatibility with telecommunications standards and protocols, making this product ideally suited for telecom infrastructure and networking applications.

Nominal Supply Voltage: 3.3 V

Designed to operate at a nominal supply voltage of 3.3 V, this product offers compatibility with standard voltage levels, ensuring seamless integration and reliable performance in various electronic systems.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm enables dense packing of components on the circuit board, increasing design flexibility and allowing for high-density interconnections, enhancing the product's functionality.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this product can withstand moderate exposure to moisture and humidity without compromising its performance, ensuring reliability in environments with varying humidity levels.

Technical Specifications

ATM/SONET/SDH Circuits ONET1101LRGETG4 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current:

118 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

ONET1101LRGETG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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