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ONET1151LRGER

Texas Instruments

ONET1151LRGER by Texas Instruments

ONET1151LRGER by Texas Instruments is a 24-terminal chip carrier with a package style of very thin profile. It operates in industrial temperature range from -40 to 100°C, supporting SDH and SONET applications. With a nominal voltage of 3.3V, it has a max supply current of 135mA for telecom circuits.

Median Price

$6.460

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,535 parts In-Stock

1+ parts

$6.460

100+ parts

$5.267

1k+ parts

$3.511

10k+ parts

-

15,535

$6.460

$5.267

$3.511

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,959 parts In-Stock

1+ parts

$6.137

100+ parts

-

1k+ parts

-

10k+ parts

-

4,959

$6.137

-

-

-

Vyrian

USA . 5,931 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,931

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 15,497 parts In-Stock

1+ parts

$5.490

100+ parts

$5.353

1k+ parts

$5.325

10k+ parts

-

15,497

$5.490

$5.353

$5.325

-

Ampacity Inc.

Singapore . 15,363 parts In-Stock

1+ parts

$5.490

100+ parts

-

1k+ parts

-

10k+ parts

-

15,363

$5.490

-

-

-

Corphita

USA . 4,892 parts In-Stock

1+ parts

$5.814

100+ parts

-

1k+ parts

-

10k+ parts

-

4,892

$5.814

-

-

-

Corohmni

South Africa . 430 parts In-Stock

1+ parts

$6.460

100+ parts

-

1k+ parts

-

10k+ parts

-

430

$6.460

-

-

-

AZTECH Wire

Italy . 205 parts In-Stock

1+ parts

$9.050

100+ parts

-

1k+ parts

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10k+ parts

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205

$9.050

-

-

-

Parana Technologies

USA . 1,783 parts In-Stock

1+ parts

$13.813

100+ parts

-

1k+ parts

$14.299

10k+ parts

-

1,783

$13.813

-

$14.299

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DigiPath Technology Company

USA . 2,130 parts In-Stock

1+ parts

$15.210

100+ parts

$13.993

1k+ parts

-

10k+ parts

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2,130

$15.210

$13.993

-

-

IDEA Electronic Components Group

UK . 1,493 parts In-Stock

1+ parts

$15.520

100+ parts

$14.744

1k+ parts

$13.968

10k+ parts

-

1,493

$15.520

$14.744

$13.968

-

ChromeModa Solutions

Germany . 546 parts In-Stock

1+ parts

$15.520

100+ parts

$12.726

1k+ parts

-

10k+ parts

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546

$15.520

$12.726

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-

Kepictronics

USA . 24,000 parts In-Stock

1+ parts

-

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24,000

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Lixinc

USA . 16,549 parts In-Stock

1+ parts

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16,549

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Futuretech Components

Singapore . 12,000 parts In-Stock

1+ parts

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12,000

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A-Z Elektronik GmbH

Germany . 10,152 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10,152

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-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,000

-

-

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iodParts Technologies Inc.

India . 103 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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103

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-

Overview

Discover the ONET1151LRGER by Texas Instruments, a top-quality ATM/SONET/SDH circuit perfect for SDH and SONET applications. With a robust package body material and nickel/palladium/gold terminals in a sleek chip carrier style, this industrial-grade telecom IC offers reliability and performance. Benefit from its low supply current, wide temperature range, and compact size, making it ideal for various telecommunications setups. Elevate your network infrastructure with the trusted brand of Texas Instruments and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the circuit, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable makes installation and assembly of the circuit easier and more efficient, saving time and effort in production processes.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options and compatibility with various systems and devices.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C ensures stable performance even under harsh environmental conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this circuit can function reliably in cold environments without any issues.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

This circuit is specifically designed to support ATM, SONET, and SDH technologies, making it a perfect choice for telecommunications applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 volts provides stable power input to the circuit, ensuring consistent and reliable operation.

Technical Specifications

ATM/SONET/SDH Circuits ONET1151LRGER attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

135 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

ONET1151LRGER Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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