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HPA00563YS

Texas Instruments

HPA00563YS by Texas Instruments

The Texas Instruments HPA00563YS is an ATM/SONET/SDH support circuit with 19 terminals, operating temperature range of -40 to 100°C. It features a rectangular surface mount package style, suitable for industrial telecom applications requiring a nominal voltage of 3.3V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,685 parts In-Stock

1+ parts

-

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1k+ parts

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8,685

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Digiode

USA . 3,889 parts In-Stock

1+ parts

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3,889

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,071 parts In-Stock

1+ parts

$13.231

100+ parts

$1,228.675

1k+ parts

$11.908

10k+ parts

-

2,071

$13.231

$1,228.675

$11.908

-

AZTECH Wire

Italy . 663 parts In-Stock

1+ parts

$14.289

100+ parts

-

1k+ parts

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663

$14.289

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DigiPath Technology Company

USA . 793 parts In-Stock

1+ parts

$14.569

100+ parts

-

1k+ parts

-

10k+ parts

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793

$14.569

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-

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ChromeModa Solutions

Germany . 3,723 parts In-Stock

1+ parts

$14.866

100+ parts

$12.190

1k+ parts

-

10k+ parts

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3,723

$14.866

$12.190

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IDEA Electronic Components Group

UK . 1,138 parts In-Stock

1+ parts

$14.866

100+ parts

$14.123

1k+ parts

$13.379

10k+ parts

-

1,138

$14.866

$14.123

$13.379

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One Stop Electronics

USA . 1,099 parts In-Stock

1+ parts

$28.000

100+ parts

-

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1,099

$28.000

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Semicontronic

India . 1,109 parts In-Stock

1+ parts

$647.000

100+ parts

$630.825

1k+ parts

$627.590

10k+ parts

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1,109

$647.000

$630.825

$627.590

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Corphita

USA . 3,288 parts In-Stock

1+ parts

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3,288

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Corohmni

South Africa . 67 parts In-Stock

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67

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Overview

Experience superior performance and reliability with the HPA00563YS by Texas Instruments, a leading manufacturer in the industry. This ATM/SONET/SDH Support Circuit offers a wide range of applications, making it a versatile choice for your projects. With its high-quality design and innovative features, this product provides unmatched value and benefits to customers. Trust Texas Instruments for cutting-edge technology that delivers exceptional results every time.

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort in the assembly process.

Package Shape: RECTANGULAR

The rectangular shape provides a compact form factor, making this product suitable for applications where space is limited.

No. of Terminals: 19

Having 19 terminals allows for versatile connectivity options and functionality in the circuit design.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Width: 0.94 mm

The narrow width allows for dense packing of components on a PCB, making it suitable for high-density designs.

Nominal Supply Voltage: 3.3 V

The 3.3 V supply voltage is a common standard in many applications, providing compatibility and ease of integration.

Technical Specifications

ATM/SONET/SDH Circuits HPA00563YS attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Additional Features:

Data rate is 11.3 Gbps

JESD-30 Code:

R-XUUC-N

Length:

1.195 mm

No. of Functions:

1

No. of Terminals:

19

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Width:

.94 mm

Trade Compliance

HPA00563YS Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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