Loading...

HPA00504RGPR

Texas Instruments

HPA00504RGPR by Texas Instruments

Texas Instruments HPA00504RGPR is a 20-terminal ATM/SONET/SDH circuit in a square chip carrier package. With a temperature range of -40 to 85°C, it operates at 3.3V and has a terminal pitch of 0.5mm. Ideal for industrial telecom applications requiring high reliability and compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,997 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,997

-

-

-

-

Digiode

USA . 2,363 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,363

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 331 parts In-Stock

1+ parts

$6.706

100+ parts

-

1k+ parts

-

10k+ parts

-

331

$6.706

-

-

-

Parana Technologies

USA . 2,067 parts In-Stock

1+ parts

$7.019

100+ parts

-

1k+ parts

$7.573

10k+ parts

-

2,067

$7.019

-

$7.573

-

DigiPath Technology Company

USA . 103 parts In-Stock

1+ parts

$7.729

100+ parts

$7.111

1k+ parts

-

10k+ parts

-

103

$7.729

$7.111

-

-

IDEA Electronic Components Group

UK . 2,075 parts In-Stock

1+ parts

$7.887

100+ parts

-

1k+ parts

$7.098

10k+ parts

-

2,075

$7.887

-

$7.098

-

ChromeModa Solutions

Germany . 1,604 parts In-Stock

1+ parts

$7.887

100+ parts

$6.467

1k+ parts

-

10k+ parts

-

1,604

$7.887

$6.467

-

-

One Stop Electronics

USA . 1,549 parts In-Stock

1+ parts

$466.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,549

$466.000

-

-

-

Semicontronic

India . 1,283 parts In-Stock

1+ parts

$631.000

100+ parts

$615.225

1k+ parts

$612.070

10k+ parts

-

1,283

$631.000

$615.225

$612.070

-

Ampacity Inc.

Singapore . 547 parts In-Stock

1+ parts

$874.000

100+ parts

-

1k+ parts

-

10k+ parts

-

547

$874.000

-

-

-

Corphita

USA . 435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

435

-

-

-

-

Corohmni

South Africa . 104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

104

-

-

-

-

Overview

Upgrade your network with the HPA00504RGPR by Texas Instruments, a high-quality ATM/SONET/SDH circuit designed to deliver reliable performance in industrial environments. With a temperature range of -40°C to 85°C and a no-lead terminal form, this chip carrier offers exceptional durability and efficiency. Perfect for telecom applications, this product features a nickel-palladium-gold finish and a compact square shape ideal for space-constrained designs. Trust Texas Instruments for cutting-edge technology that enhances your network infrastructure.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the circuit, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and convenient installation onto circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Optimal shape for efficient use of space on circuit boards, maximizing component placement and density.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments with varying temperature conditions.

Nominal Supply Voltage: 3.3 V

Operates efficiently at a standard voltage level commonly used in electronic circuits, ensuring compatibility with other components.

Technical Specifications

ATM/SONET/SDH Circuits HPA00504RGPR attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

HPA00504RGPR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 3