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ONET3301PARGTT

Texas Instruments

ONET3301PARGTT by Texas Instruments

ONET3301PARGTT by Texas Instruments is an ATM/SONET/SDH circuit with a 16-terminal chip carrier package. It operates b/w -40 to 85°C, supporting SDH and SONET applications at a supply voltage of 3.3V. This telecom IC has a compact square shape, suitable for surface mount assembly in industrial environments.

Median Price

$13.080

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,250 parts In-Stock

1+ parts

-

100+ parts

$11.320

1k+ parts

$10.130

10k+ parts

$9.540

5,250

-

$11.320

$10.130

$9.540

DigiKey

USA . 5,250 parts In-Stock

1+ parts

-

100+ parts

$13.080

1k+ parts

-

10k+ parts

-

5,250

-

$13.080

-

-

Verical

USA . 2,750 parts In-Stock

1+ parts

-

100+ parts

$14.150

1k+ parts

$12.662

10k+ parts

$11.925

2,750

-

$14.150

$12.662

$11.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,665 parts In-Stock

1+ parts

$11.951

100+ parts

-

1k+ parts

-

10k+ parts

-

3,665

$11.951

-

-

-

Vyrian

USA . 1,993 parts In-Stock

1+ parts

$12.580

100+ parts

-

1k+ parts

-

10k+ parts

-

1,993

$12.580

-

-

-

LIBRA Elektronik GmbH

Germany . 439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

439

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 844 parts In-Stock

1+ parts

$10.060

100+ parts

-

1k+ parts

$10.615

10k+ parts

-

844

$10.060

-

$10.615

-

ChromeModa Solutions

Germany . 126 parts In-Stock

1+ parts

$11.303

100+ parts

$9.268

1k+ parts

-

10k+ parts

-

126

$11.303

$9.268

-

-

IDEA Electronic Components Group

UK . 77 parts In-Stock

1+ parts

$11.303

100+ parts

$10.738

1k+ parts

$10.173

10k+ parts

-

77

$11.303

$10.738

$10.173

-

Corphita

USA . 3,455 parts In-Stock

1+ parts

$11.322

100+ parts

-

1k+ parts

-

10k+ parts

-

3,455

$11.322

-

-

-

DigiPath Technology Company

USA . 1,710 parts In-Stock

1+ parts

-

100+ parts

$10.191

1k+ parts

-

10k+ parts

-

1,710

-

$10.191

-

-

Perfect Parts

USA . 874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

874

-

-

-

-

Microchip USA

USA . 494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

494

-

-

-

-

Overview

Elevate your network performance with the Texas Instruments ONET3301PARGTT, a top-of-the-line ATM/SONET/SDH circuit designed to deliver seamless connectivity and reliability. Crafted by industry leader Texas Instruments, this cutting-edge product offers unparalleled quality and precision. From SDH to SONET applications, this innovative solution guarantees optimal results. Experience the value of superior technology with the ONET3301PARGTT and unlock a world of benefits for your network needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for telecommunications equipment.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making the product suitable for automated manufacturing processes.

No. of Terminals: 16

Having 16 terminals provides versatile connectivity options for integrating the product into various circuit designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh industrial environments.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power systems in telecommunications applications.

Technical Specifications

ATM/SONET/SDH Circuits ONET3301PARGTT attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

ONET3301PARGTT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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