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ONET2501PARGT

Texas Instruments

ONET2501PARGT by Texas Instruments

ONET2501PARGT by Texas Instruments is an ATM/SONET/SDH circuit with a 3.3V supply voltage and 16 terminals in a square package shape. It operates b/w -40 to 85°C, suitable for industrial applications like SDH and SONET. This telecom IC supports very thin profile chip carrier packages with surface mount capability.

Median Price

$3.970

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,872 parts In-Stock

1+ parts

-

100+ parts

$3.440

1k+ parts

$3.080

10k+ parts

$2.900

3,872

-

$3.440

$3.080

$2.900

DigiKey

USA . 3,872 parts In-Stock

1+ parts

-

100+ parts

$3.970

1k+ parts

-

10k+ parts

-

3,872

-

$3.970

-

-

Verical

USA . 3,872 parts In-Stock

1+ parts

-

100+ parts

$4.300

1k+ parts

$3.850

10k+ parts

$3.625

3,872

-

$4.300

$3.850

$3.625

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 751 parts In-Stock

1+ parts

$3.629

100+ parts

-

1k+ parts

-

10k+ parts

-

751

$3.629

-

-

-

Vyrian

USA . 678 parts In-Stock

1+ parts

$3.820

100+ parts

-

1k+ parts

-

10k+ parts

-

678

$3.820

-

-

-

DigiKey Marketplace

USA . 3,872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,872

-

-

-

-

LWI Electronics Inc

India . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,444 parts In-Stock

1+ parts

$3.438

100+ parts

-

1k+ parts

-

10k+ parts

-

1,444

$3.438

-

-

-

Parana Technologies

USA . 649 parts In-Stock

1+ parts

$15.867

100+ parts

-

1k+ parts

$16.224

10k+ parts

-

649

$15.867

-

$16.224

-

DigiPath Technology Company

USA . 1,353 parts In-Stock

1+ parts

$17.471

100+ parts

-

1k+ parts

-

10k+ parts

-

1,353

$17.471

-

-

-

ChromeModa Solutions

Germany . 6,543 parts In-Stock

1+ parts

$17.828

100+ parts

$14.619

1k+ parts

-

10k+ parts

-

6,543

$17.828

$14.619

-

-

IDEA Electronic Components Group

UK . 919 parts In-Stock

1+ parts

$17.828

100+ parts

$16.937

1k+ parts

$16.045

10k+ parts

-

919

$17.828

$16.937

$16.045

-

Authorized Procurement Solutions

USA . 8,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,500

-

-

-

-

Microchip USA

USA . 4,982 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,982

-

-

-

-

Overview

Unlock the power of high-speed data transmission with the ONET2501PARGT by Texas Instruments. Designed for ATM/SONET/SDH circuits, this cutting-edge technology offers unparalleled quality and reliability. Perfect for SDH and SONET applications, this product boasts a compact design and industrial-grade temperature range, ensuring optimal performance in any environment. Trust Texas Instruments to deliver superior telecom ICs that provide seamless connectivity and efficiency. Experience the difference with the ONET2501PARGT - your gateway to enhanced communication solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provide durability and protection for the circuit, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, saving time and effort during assembly.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in various environments without risk of overheating.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance for optimal signal transmission.

Applications: SDH; SONET

Designed specifically for SDH and SONET applications, ensuring compatibility and efficient operation within these network systems.

Technical Specifications

ATM/SONET/SDH Circuits ONET2501PARGT attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.04 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

ONET2501PARGT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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