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ONET1131ECRSMR

Texas Instruments

ONET1131ECRSMR by Texas Instruments

ONET1131ECRSMR by Texas Instruments is a 32-terminal ATM/SONET/SDH transceiver chip carrier with a very thin profile. Operating temperature ranges from -40 to 100°C, suitable for industrial applications like SONET telecom systems. It has a nominal voltage of 2.5V and max supply current of 200mA, making it ideal for high-speed telecommunications networks.

Median Price

$22.875

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,478 parts In-Stock

1+ parts

$22.875

100+ parts

$20.333

1k+ parts

$14.951

10k+ parts

-

22,478

$22.875

$20.333

$14.951

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 203 parts In-Stock

1+ parts

$21.731

100+ parts

-

1k+ parts

-

10k+ parts

-

203

$21.731

-

-

-

Vyrian

USA . 5,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,355

-

-

-

-

Cyclops Electronics Ltd

UK . 2,270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,270

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,255 parts In-Stock

1+ parts

$11.229

100+ parts

-

1k+ parts

$11.665

10k+ parts

-

1,255

$11.229

-

$11.665

-

DigiPath Technology Company

USA . 1,118 parts In-Stock

1+ parts

$12.365

100+ parts

$11.375

1k+ parts

-

10k+ parts

-

1,118

$12.365

$11.375

-

-

IDEA Electronic Components Group

UK . 803 parts In-Stock

1+ parts

$12.617

100+ parts

$11.986

1k+ parts

$11.355

10k+ parts

-

803

$12.617

$11.986

$11.355

-

ChromeModa Solutions

Germany . 639 parts In-Stock

1+ parts

$12.617

100+ parts

$10.346

1k+ parts

-

10k+ parts

-

639

$12.617

$10.346

-

-

AZTECH Wire

Italy . 937 parts In-Stock

1+ parts

$16.960

100+ parts

-

1k+ parts

-

10k+ parts

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937

$16.960

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-

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Ampacity Inc.

Singapore . 22,151 parts In-Stock

1+ parts

$19.440

100+ parts

-

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10k+ parts

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22,151

$19.440

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-

-

Corphita

USA . 1,542 parts In-Stock

1+ parts

$20.588

100+ parts

-

1k+ parts

-

10k+ parts

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1,542

$20.588

-

-

-

Microchip USA

USA . 5,137 parts In-Stock

1+ parts

$55.680

100+ parts

$54.880

1k+ parts

$54.480

10k+ parts

$54.090

5,137

$55.680

$54.880

$54.480

$54.090

A-Z Elektronik GmbH

Germany . 6,173 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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6,173

-

-

-

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Lixinc

USA . 5,807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,807

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

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Futuretech Components

Singapore . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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500

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Overview

Unlock the power of high-speed data transmission with the ONET1131ECRSMR by Texas Instruments. Designed for ATM/SONET/SDH Circuits, this cutting-edge telecom IC offers unmatched quality and reliability. With a wide temperature range and innovative packaging, this product is perfect for industrial applications. Experience seamless connectivity and superior performance with the ONET1131ECRSMR, setting new standards in the industry. Elevate your projects to new heights with Texas Instruments' state-of-the-art technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into circuit boards, saving space and facilitating automated assembly.

No. of Terminals: 32

With 32 terminals, this product offers a sufficient number of connection points for versatile applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function effectively in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold for terminal finish ensures good conductivity and resistance to corrosion.

Maximum Seated Height: 1 mm

The low seated height makes this product suitable for applications with limited vertical space.

Telecom IC Type: ATM/SONET/SDH TRANSCEIVER

Designed specifically for ATM/Sonet/SDH circuits, this product offers optimized performance in telecommunications applications.

Nominal Supply Voltage: 2.5 V

The 2.5V supply voltage is common in many electronic systems, making this product compatible with various setups.

Technical Specifications

ATM/SONET/SDH Circuits ONET1131ECRSMR attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SONET

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

200 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ONET1131ECRSMR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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