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ONET1151MRGTT

Texas Instruments

ONET1151MRGTT by Texas Instruments

ONET1151MRGTT by Texas Instruments is an ATM/SONET/SDH circuit with a package style of chip carrier, heat sink/slug, and very thin profile. It operates in industrial temperature grade range from -40°C to 100°C, supporting SDH and SONET applications. With a nominal voltage of 3.3V and max supply current of 100mA, it features a terminal pitch of 0.5mm for compact designs.

Median Price

$13.847

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,404 parts In-Stock

1+ parts

$14.024

100+ parts

$12.250

1k+ parts

$8.448

10k+ parts

-

2,404

$14.024

$12.250

$8.448

-

DigiKey

USA . 3,256 parts In-Stock

1+ parts

-

100+ parts

$12.200

1k+ parts

-

10k+ parts

-

3,256

-

$12.200

-

-

Rochester

USA . 3,102 parts In-Stock

1+ parts

-

100+ parts

$13.670

1k+ parts

$12.230

10k+ parts

$11.510

3,102

-

$13.670

$12.230

$11.510

Verical

USA . 1,598 parts In-Stock

1+ parts

-

100+ parts

$17.087

1k+ parts

$15.287

10k+ parts

$14.387

1,598

-

$17.087

$15.287

$14.387

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,467 parts In-Stock

1+ parts

$11.144

100+ parts

-

1k+ parts

-

10k+ parts

-

1,467

$11.144

-

-

-

Vyrian

USA . 1,843 parts In-Stock

1+ parts

$11.730

100+ parts

-

1k+ parts

-

10k+ parts

-

1,843

$11.730

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,974 parts In-Stock

1+ parts

$10.557

100+ parts

-

1k+ parts

-

10k+ parts

-

2,974

$10.557

-

-

-

Parana Technologies

USA . 1,214 parts In-Stock

1+ parts

$11.966

100+ parts

$1,111.229

1k+ parts

$10.769

10k+ parts

-

1,214

$11.966

$1,111.229

$10.769

-

DigiPath Technology Company

USA . 2,293 parts In-Stock

1+ parts

$13.176

100+ parts

$12.122

1k+ parts

-

10k+ parts

-

2,293

$13.176

$12.122

-

-

ChromeModa Solutions

Germany . 4,232 parts In-Stock

1+ parts

$13.445

100+ parts

$11.025

1k+ parts

-

10k+ parts

-

4,232

$13.445

$11.025

-

-

IDEA Electronic Components Group

UK . 243 parts In-Stock

1+ parts

$13.445

100+ parts

$12.773

1k+ parts

$12.100

10k+ parts

-

243

$13.445

$12.773

$12.100

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Overview

Experience the cutting-edge technology of Texas Instruments with the ONET1151MRGTT telecom IC, designed for ATM/SONET/SDH circuits. This high-quality product offers unparalleled performance and reliability, making it ideal for a variety of applications in the telecommunications industry. With its advanced features and durable construction, customers can trust in the value and benefits that this product provides. Upgrade your systems today with Texas Instruments and elevate your communication network to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resilience, making the product suitable for various environments and conditions.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Allows for a compact design, optimizing space utilization on the PCB.

No. of Terminals: 16

Offers sufficient connectivity options for integrating the circuit into different systems.

Maximum Operating Temperature: 100 °C

Ensures stable performance even in high-temperature environments, increasing reliability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance for long-lasting connections.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Designed specifically for supporting ATM, SONET, and SDH networks, ensuring compatibility and optimized performance.

Nominal Supply Voltage: 3.3 V

Operates efficiently at a common voltage level, facilitating integration with existing systems.

Technical Specifications

ATM/SONET/SDH Circuits ONET1151MRGTT attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

100 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

ONET1151MRGTT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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