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ADN2816ACPZ-RL7

Analog Devices

ADN2816ACPZ-RL7 by Analog Devices

Analog Devices' ADN2816ACPZ-RL7 is a 32-terminal ATM/SONET/SDH circuit with 3.3V supply, operating from -40 to 85°C. It features a square surface mount package and is ideal for SDH and SONET applications in industrial settings. The IC has a max supply current of 122mA and terminal pitch of 0.5mm, making it suitable for telecom clock recovery circuits.

Median Price

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Lifecycle Status

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5

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1k+

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Vyrian

USA . 7,451 parts In-Stock

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Digiode

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Nova Conductors

Japan . 50 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,299 parts In-Stock

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$12.610

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$12.610

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AZTECH Wire

Italy . 715 parts In-Stock

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$14.097

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Corohmni

South Africa . 1,000 parts In-Stock

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$14.376

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$14.376

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Parana Technologies

USA . 3,800 parts In-Stock

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$15.965

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$14.848

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$15.965

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IDEA Electronic Components Group

UK . 650 parts In-Stock

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$17.167

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$16.309

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$16.309

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DigiPath Technology Company

USA . 3,800 parts In-Stock

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$26.781

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$25.709

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$25.709

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Component Stockers USA

USA . 539 parts In-Stock

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$99.990

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Ampacity Inc.

Singapore . 1,108 parts In-Stock

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$218.000

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One Stop Electronics

USA . 993 parts In-Stock

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Semicontronic

India . 1,318 parts In-Stock

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$628.000

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$612.300

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$609.160

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Alle Elektronik GmbH

Germany . 5,774 parts In-Stock

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Continental Prestige Electronics

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Kepictronics

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Glotronic Ltd.

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Argo Parts USA

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Microchip USA

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Futuretech Components

Singapore . 490 parts In-Stock

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Corphita

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Bastille Electronics

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Overview

Elevate your network equipment with the ADN2816ACPZ-RL7 by Analog Devices, a top-tier manufacturer known for innovative solutions in ATM/SONET/SDH circuits. This advanced telecom IC offers superior performance in clock recovery, making it ideal for SDH and SONET applications. With a sleek square package shape, surface mount capability, and industrial-grade temperature tolerance, this chip carrier provides unmatched reliability and precision. Trust Analog Devices to deliver cutting-edge technology that propels your systems to new heights of efficiency and connectivity.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and convenient mounting of the product onto a PCB, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square shape provides uniformity in design and allows for efficient use of space on the PCB.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes it compatible with many existing systems and ensures reliable performance.

No. of Terminals: 32

Having 32 terminals allows for multiple connections and functions within the circuit, enhancing its versatility.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers efficient heat dissipation, compact size, and easy integration into various systems.

Maximum Operating Temperature: 85°C

The high maximum operating temperature ensures the product can withstand harsh environments and prolonged use.

Minimum Operating Temperature: -40°C

The low minimum operating temperature allows for reliable performance in cold conditions, offering flexibility in deployment.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and reliable electrical connections, ensuring long-term durability.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections, minimizing the risk of signal loss or interference.

Maximum Seated Height: 1 mm

The low seated height saves vertical space on the PCB and enables compact designs for applications with size constraints.

Width: 5 mm

The 5mm width offers a balance between compact size and ease of handling during assembly and installation.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds allows for quick and efficient soldering processes, reducing production time and costs.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand high-temperature soldering processes, ensuring reliable connections.

Length: 5 mm

The 5mm length complements the compact width and height, offering a balanced form factor for various PCB layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation across a wide range of temperature conditions, making it suitable for industrial applications.

Applications: SDH; SONET

Designed specifically for SDH and SONET applications, this product provides optimized performance and compatibility in telecom networks.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental regulations and offers improved soldering reliability and joint strength.

Maximum Supply Current: 122 mA

The 122mA maximum supply current ensures efficient power consumption and extends the product's operational lifespan.

Telecom IC Type: ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

Being a clock recovery circuit designed for ATM, SONET, and SDH applications, this product offers precise synchronization and timing accuracy in telecom systems.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and stable performance.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density connections and precise signal routing, enhancing overall circuit performance.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product is suitable for reflow soldering processes and storage in environments with moderate humidity levels.

Technical Specifications

ATM/SONET/SDH Circuits ADN2816ACPZ-RL7 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

122 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

ADN2816ACPZ-RL7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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