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ADN2806ACPZ-RL7

Analog Devices

ADN2806ACPZ-RL7 by Analog Devices

ADN2806ACPZ-RL7 by Analog Devices is a 32-terminal ATM/SONET/SDH circuit with a 3.3V supply voltage and operates in industrial temperature range (-40 to 85 °C). It features a square surface mount package style, matte tin terminal finish, and is ideal for SDH and SONET applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,431 parts In-Stock

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Digiode

USA . 514 parts In-Stock

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514

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Native Components

USA . 110 parts In-Stock

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$2.140

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$2.140

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Northwest PG Solutions

USA . 912 parts In-Stock

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$2.354

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$2.354

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AZTECH Wire

Italy . 666 parts In-Stock

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$5.916

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Parana Technologies

USA . 1,506 parts In-Stock

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$15.009

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$13.959

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IDEA Electronic Components Group

UK . 1,212 parts In-Stock

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$16.139

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$15.332

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$15.332

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DigiPath Technology Company

USA . 1,965 parts In-Stock

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$25.177

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$24.170

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$24.170

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$24.170

Semicontronic

India . 561 parts In-Stock

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$613.000

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$597.675

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$594.610

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One Stop Electronics

USA . 374 parts In-Stock

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$860.000

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Kepictronics

USA . 5,500 parts In-Stock

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Microchip USA

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Vigor

Singapore . 1,836 parts In-Stock

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Corphita

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$12.985

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$12.024

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$12.024

100

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$12.985

$12.024

$12.024

Overview

Unlock the power of precision and reliability with the Analog Devices ADN2806ACPZ-RL7. Crafted by a renowned manufacturer, this ATM/SONET/SDH circuit delivers seamless performance in demanding telecom applications like SDH and SONET. With its cutting-edge technology and compact design, this product offers unparalleled value and benefits to customers seeking top-notch clock recovery circuits. Trust in the quality and expertise of Analog Devices to elevate your telecommunications systems to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape is commonly used for integrated circuits and provides uniformity in design and layout.

Power Supplies (V): 3.3

Operates efficiently with a low power supply voltage, helping to reduce power consumption and heat generation.

No. of Terminals: 32

Having 32 terminals allows for multiple connections and functions, increasing versatility and compatibility with various systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and compact design.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without losing performance or reliability, suitable for demanding industrial environments.

Minimum Operating Temperature: -40 °C

Maintains functionality even in extremely low temperatures, making it suitable for a wide range of operating conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term durability and connectivity.

Terminal Position: QUAD

Quad terminal position allows for secure connections and stable mounting, reducing the risk of damage or disconnection.

Maximum Seated Height: 1 mm

With a low maximum seated height, this product is compact and can be easily integrated into tight spaces or slim devices.

Width: 5 mm

The compact width of 5mm ensures efficient use of space on a circuit board, ideal for designs with limited area.

Length: 5 mm

The short length of 5mm contributes to a compact overall footprint, allowing for densely packed circuitry in small devices.

Temperature Grade: INDUSTRIAL

Built to withstand industrial temperature ranges, ensuring reliable performance in harsh environmental conditions.

Applications: SDH; SONET

Designed for specific applications like SDH and SONET, ensuring compatibility and optimal performance in telecommunications systems.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations, ideal for sustainable and eco-conscious designs.

Telecom IC Type: ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

Specifically designed for clock recovery in ATM, SONET, and SDH systems, providing precise synchronization and signal processing capabilities.

Nominal Supply Voltage: 3.3 V

Operates at a standard nominal supply voltage of 3.3V, ensuring compatibility with common power sources and electronics.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density packaging and precise connections, enabling advanced circuit design.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level of 3, the product can withstand typical exposure to humidity during storage and assembly.

Technical Specifications

ATM/SONET/SDH Circuits ADN2806ACPZ-RL7 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

ADN2806ACPZ-RL7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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