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ADN2816ACPZ

Analog Devices

ADN2816ACPZ by Analog Devices

Analog Devices' ADN2816ACPZ is a 32-terminal ATM/SONET/SDH circuit in a square surface-mount package with 3.3V supply voltage. Operating b/w -40 to 85°C, it's ideal for SDH and SONET applications, featuring a max supply current of 122mA and terminal pitch of 0.5mm.

Median Price

$81.730

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Digiode

USA . 989 parts In-Stock

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$22.572

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989

$22.572

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Component Electronics Inc.

Canada . 5 parts In-Stock

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$38.460

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$28.850

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$25.000

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$38.460

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$25.000

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DF Sales Co.

USA . 2 parts In-Stock

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$125.000

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$125.000

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DF Sales Co.

USA . 2 parts In-Stock

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Vyrian

USA . 1,977 parts In-Stock

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VNN

France . 968 parts In-Stock

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Sensible Micro Corp

USA . 322 parts In-Stock

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Bristol Electronics

USA . 17 parts In-Stock

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Classic Components Corporation

USA . 10 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Carlin Systems, Inc.

USA . 3 parts In-Stock

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NexGen Digital

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Parana Technologies

USA . 1,129 parts In-Stock

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$5.600

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$5.208

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$5.600

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IDEA Electronic Components Group

UK . 1,398 parts In-Stock

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$6.021

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$5.720

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$6.021

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Aztec Data Supply Inc.

USA . 1,089 parts In-Stock

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$8.750

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$8.750

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DigiPath Technology Company

USA . 2,294 parts In-Stock

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$9.393

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$9.017

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AZTECH Wire

Italy . 320 parts In-Stock

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$10.570

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Corohmni

South Africa . 722 parts In-Stock

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$16.764

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$20.200

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Corphita

USA . 420 parts In-Stock

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$21.384

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Semicontronic

India . 1 parts In-Stock

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$43.960

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$42.861

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$42.641

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$43.960

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Vigor

Singapore . 528 parts In-Stock

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$60.000

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Lixinc

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Argo Parts USA

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A-Z Elektronik GmbH

Germany . 2,564 parts In-Stock

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GreenTree Electronics

Israel . 960 parts In-Stock

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Bastille Electronics

Australia . 700 parts In-Stock

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Continental Prestige Electronics

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Kepictronics

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Overview

Boost your network performance with the Analog Devices ADN2816ACPZ telecom IC. Designed for SDH and SONET applications, this ATM/SONET/SDH clock recovery circuit offers exceptional quality and reliability, backed by the reputable manufacturer Analog Devices. With a wide operating temperature range, low power consumption, and a compact square chip carrier package, this product provides outstanding value and performance for your networking needs. Upgrade your systems today with the ADN2816ACPZ and experience enhanced efficiency and precision in your telecommunications operations.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing production costs.

Package Shape: SQUARE

Provides a compact design for space-constrained applications, maximizing board space.

Power Supplies (V): 3.3

Operates on a common voltage, making it compatible with a wide range of systems and reducing the need for additional power conversion components.

No. of Terminals: 32

Offers ample connectivity options for various input and output requirements, enhancing flexibility and scalability.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Ensures efficient heat dissipation and space-saving design, ideal for high-density applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature ranges, ensuring reliable performance under challenging conditions.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments, expanding its usability in various settings.

Terminal Finish: MATTE TIN

Provides a durable and corrosion-resistant terminal finish, ensuring long-term reliability and stability.

Terminal Position: QUAD

Facilitates easy and secure PCB mounting, improving the overall durability and robustness of the product.

Maximum Seated Height: 1 mm

Offers a low-profile design, ideal for applications with height restrictions, enhancing overall system integration possibilities.

Width: 5 mm

Compact width allows for efficient use of board space, enabling high-density circuit designs.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and reliable solder reflow processes, ensuring consistent and high-quality solder joints.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures, ensuring proper soldering and board reliability during manufacturing.

Length: 5 mm

Compact length contributes to space-saving designs, suitable for applications with limited board real estate.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature specifications, ensuring reliable operation in harsh environments.

Applications: SDH; SONET

Specifically tailored for SDH and SONET applications, ensuring compatibility and high performance in telecommunications systems.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations and ensure compatibility with lead-free soldering processes.

Maximum Supply Current: 122 mA

Supports high current requirements, suitable for powering various components within the circuit.

Telecom IC Type: ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

Specifically designed for clock recovery in ATM, SONET, and SDH networks, ensuring precise timing synchronization for data transmission.

Nominal Supply Voltage: 3.3 V

Operates at a common voltage level, ensuring compatibility with standard power sources and simplifying system integration.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density connections, suitable for compact circuit designs with multiple terminals.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure, ensuring reliability in humid environments.

Technical Specifications

ATM/SONET/SDH Circuits ADN2816ACPZ attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

122 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

ADN2816ACPZ Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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