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ADN2818ACPZ-RL

Analog Devices

ADN2818ACPZ-RL by Analog Devices

Analog Devices' ADN2818ACPZ-RL is a 32-terminal ATM/SONET/SDH circuit with 3.3V supply, suitable for SDH and SONET applications. It operates b/w -40 to 85 °C, in a square surface-mount package measuring 5x5mm, with a max seated height of 1mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,340 parts In-Stock

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5,340

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Digiode

USA . 861 parts In-Stock

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861

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Distributors (Availability)

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Native Components

USA . 877 parts In-Stock

1+ parts

$0.270

100+ parts

-

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$0.259

877

$0.270

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$0.259

Northwest PG Solutions

USA . 457 parts In-Stock

1+ parts

$0.297

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$0.262

457

$0.297

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$0.262

Parana Technologies

USA . 1,630 parts In-Stock

1+ parts

$16.682

100+ parts

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$15.515

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1,630

$16.682

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$15.515

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Aztec Data Supply Inc.

USA . 500 parts In-Stock

1+ parts

$17.522

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500

$17.522

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IDEA Electronic Components Group

UK . 721 parts In-Stock

1+ parts

$17.938

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$17.041

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$17.041

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721

$17.938

$17.041

$17.041

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AZTECH Wire

Italy . 289 parts In-Stock

1+ parts

$19.875

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289

$19.875

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DigiPath Technology Company

USA . 1,026 parts In-Stock

1+ parts

$27.983

100+ parts

$26.864

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$26.864

1,026

$27.983

$26.864

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$26.864

Semicontronic

India . 896 parts In-Stock

1+ parts

$33.000

100+ parts

$32.175

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$32.010

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896

$33.000

$32.175

$32.010

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Ampacity Inc.

Singapore . 1,094 parts In-Stock

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$144.000

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1,094

$144.000

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One Stop Electronics

USA . 600 parts In-Stock

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$860.000

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$860.000

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Corphita

USA . 187 parts In-Stock

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Overview

Elevate your network performance with the cutting-edge ADN2818ACPZ-RL by Analog Devices. Known for their superior quality and reliability, Analog Devices delivers top-of-the-line ATM/SONET/SDH Circuits that set the industry standard. This versatile chip carrier is perfect for SDH and SONET applications, offering a wide temperature range and low power consumption. Say goodbye to downtime and hello to seamless connectivity with the ADN2818ACPZ-RL, providing value, efficiency, and unmatched performance to customers looking to stay ahead in the fast-paced world of telecommunications.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost in production.

Package Shape: SQUARE

Square shape packaging helps maximize space efficiency on the circuit board, allowing for denser layouts and potentially saving on overall system size.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes it compatible with many existing systems and power sources, increasing versatility.

No. of Terminals: 32

With a high number of terminals, this product can support complex connections and functionalities, enabling versatile usage in various applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile packaging styles ensures efficient heat dissipation, compact design, and compatibility with space-constrained environments.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, this product is reliable in demanding conditions and provides stability in performance.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this product is suitable for use in both extreme cold and hot environments, enhancing its versatility and reliability.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, improving the product's durability and longevity.

Terminal Position: QUAD

Quad terminal position allows for stable and secure connections, preventing signal disruptions and ensuring consistent performance.

Maximum Seated Height: 1 mm

Low seated height makes this product suitable for compact designs and space-constrained installations, enabling flexibility in system layouts.

Width: 5 mm

Compact width dimension enables efficient use of board space and facilitates integration into tight layouts or assemblies.

Maximum Time At Peak Reflow Temperature (s): 30

With a specified reflow time, this product ensures proper soldering and reliability during the manufacturing process, leading to consistent quality.

Peak Reflow Temperature °C: 260

Ability to withstand high reflow temperatures indicates robustness and reliability during assembly and rework processes.

Length: 5 mm

Compact length dimension allows for efficient use of board space and facilitates integration into various system designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the product can withstand harsh industrial environments, making it suitable for diverse applications.

Applications: SDH; SONET

Designed for specific applications like SDH and SONET, this product offers optimized performance and compatibility in telecommunications networks.

Terminal Form: NO LEAD

Lead-free terminal form meets environmental regulations and standards, reducing environmental impact and increasing safety for handling and disposal.

Maximum Supply Current: 0.217 mA

Low maximum supply current consumption minimizes power usage and heat generation, enhancing energy efficiency and overall performance.

Telecom IC Type: ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

Specifically designed as a clock recovery circuit for ATM, SONET, and SDH systems, ensuring precise timing and synchronization for reliable network operation.

Nominal Supply Voltage: 3.3 V

Operating at a standard nominal supply voltage of 3.3V ensures compatibility with common power sources, simplifying integration into existing systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact board layouts, enabling efficient use of space and supporting advanced system designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling practices to maintain product integrity and reliability in humid environments.

Technical Specifications

ATM/SONET/SDH Circuits ADN2818ACPZ-RL attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.217 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

ADN2818ACPZ-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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