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ADN2813ACPZ-RL7

Analog Devices

ADN2813ACPZ-RL7 by Analog Devices

Analog Devices' ADN2813ACPZ-RL7 is a 32-terminal ATM/SONET/SDH circuit with 3.3V supply, operating from -40 to 85 °C. It features a square surface mount package, matte tin finish, and industrial temperature grade suitable for SDH and SONET applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,263 parts In-Stock

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Digiode

USA . 528 parts In-Stock

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528

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Parana Technologies

USA . 1,656 parts In-Stock

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$15.334

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$14.260

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$15.334

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$14.260

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AZTECH Wire

Italy . 752 parts In-Stock

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$15.749

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$15.749

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IDEA Electronic Components Group

UK . 1,100 parts In-Stock

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$16.488

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$15.664

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$15.664

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Native Components

USA . 465 parts In-Stock

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$18.507

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Northwest PG Solutions

USA . 2,133 parts In-Stock

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$20.357

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$18.322

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DigiPath Technology Company

USA . 624 parts In-Stock

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$25.721

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$24.692

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$24.692

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$25.721

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$24.692

Component Stockers USA

USA . 320 parts In-Stock

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$99.990

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Semicontronic

India . 820 parts In-Stock

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$491.000

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$478.725

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$476.270

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One Stop Electronics

USA . 161 parts In-Stock

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$807.000

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QUARKTWIN TECHNOLOGY LTD

USA . 24,765 parts In-Stock

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Kepictronics

USA . 5,500 parts In-Stock

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Microchip USA

USA . 4,734 parts In-Stock

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Vigor

Singapore . 1,464 parts In-Stock

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Corphita

USA . 694 parts In-Stock

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Overview

Enhance your telecommunications systems with the top-quality ADN2813ACPZ-RL7 by Analog Devices. Designed for ATM/SONET/SDH applications, this surface-mount IC boasts a square package shape and industrial temperature grade for reliable performance in demanding environments. With a nominal supply voltage of 3.3V and maximum supply current of 155mA, this clock recovery circuit ensures seamless operation. Trust Analog Devices, a reputable manufacturer known for delivering cutting-edge solutions. Upgrade your network with the ADN2813ACPZ-RL7 and experience enhanced efficiency and performance like never before.

Feature Benefit Bullets

Surface Mount: YES

This product is surface mountable which makes it suitable for automated assembly and reduces the need for manual labor.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, optimizing layout and design.

Power Supplies (V): 3.3

Operates on a standard voltage supply of 3.3V, making it compatible with many existing systems and easy to integrate.

No. of Terminals: 32

Having 32 terminals provides a sufficient number of connections for various inputs and outputs, allowing for versatile usage.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand demanding environmental conditions and extended use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for reliable performance in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: QUAD

The quad terminal position allows for easy connection and integration into quad systems, enhancing compatibility and functionality.

Maximum Seated Height: 1 mm

With a maximum seated height of 1mm, this product offers a low profile design that is suitable for compact electronic devices.

Width: 5 mm

The 5mm width provides a compact form factor that can fit into tight spaces on a circuit board, enabling efficient layout and design.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product is easy to solder and ensures reliable connections during assembly.

Peak Reflow Temperature °C: 260

A high peak reflow temperature of 260 °C allows for reliable solder joints and ensures durability under various operating conditions.

Length: 5 mm

Measuring 5mm in length, this product has a balanced form factor that enhances its versatility and adaptability in different applications.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product meets the temperature and reliability requirements of industrial applications, making it a robust choice.

Applications: SDH; SONET

Specifically designed for SDH and SONET applications, this product offers optimized performance and compatibility in these telecom technologies.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and complies with lead-free regulations, making this product a sustainable choice.

Maximum Supply Current: 155 mA

With a maximum supply current of 155mA, this product operates efficiently while consuming low power, contributing to energy savings.

Telecom IC Type: ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

The ATM/SONET/SDH clock recovery circuit type is specifically tailored for telecom applications, ensuring accurate clock synchronization and signal processing.

Nominal Supply Voltage: 3.3 V

Operates at a nominal supply voltage of 3.3V, providing stable power delivery and compatibility with standard voltage levels.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for close spacing of terminals, facilitating compact design and efficient signal routing on a circuit board.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is suitable for standard moisture exposure during storage and assembly processes.

Technical Specifications

ATM/SONET/SDH Circuits ADN2813ACPZ-RL7 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

155 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

ADN2813ACPZ-RL7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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