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ONET8541TY

Texas Instruments

ONET8541TY by Texas Instruments

ONET8541TY by Texas Instruments is a telecom IC for SONET applications. It operates at 3.3V with max supply current of 40mA. With industrial temperature grade, it supports ATM/SONET/SDH circuits in a surface mount rectangular package style.

Median Price

$2.260

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 720 parts In-Stock

1+ parts

$2.260

100+ parts

$2.210

1k+ parts

$2.170

10k+ parts

-

720

$2.260

$2.210

$2.170

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,379 parts In-Stock

1+ parts

$2.565

100+ parts

-

1k+ parts

-

10k+ parts

-

1,379

$2.565

-

-

-

Vyrian

USA . 5,277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,277

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,372 parts In-Stock

1+ parts

$2.430

100+ parts

-

1k+ parts

-

10k+ parts

-

3,372

$2.430

-

-

-

Parana Technologies

USA . 1,410 parts In-Stock

1+ parts

$15.206

100+ parts

-

1k+ parts

$15.606

10k+ parts

-

1,410

$15.206

-

$15.606

-

DigiPath Technology Company

USA . 180 parts In-Stock

1+ parts

$16.743

100+ parts

$15.404

1k+ parts

-

10k+ parts

-

180

$16.743

$15.404

-

-

ChromeModa Solutions

Germany . 1,833 parts In-Stock

1+ parts

$17.085

100+ parts

$14.010

1k+ parts

-

10k+ parts

-

1,833

$17.085

$14.010

-

-

IDEA Electronic Components Group

UK . 742 parts In-Stock

1+ parts

$17.085

100+ parts

$16.231

1k+ parts

$15.376

10k+ parts

-

742

$17.085

$16.231

$15.376

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AZTECH Wire

Italy . 325 parts In-Stock

1+ parts

$19.770

100+ parts

-

1k+ parts

-

10k+ parts

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325

$19.770

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Component Stockers USA

USA . 729 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

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729

$99.990

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 15,664 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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15,664

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Metaverse IC Inc.

Canada . 319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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319

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-

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Overview

Enhance your telecom systems with the ONET8541TY by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This ATM/SONET/SDH circuit is designed for maximum performance in SONET applications, providing seamless connectivity and optimal signal processing. With its compact rectangular shape and advanced features, this product offers unmatched value and benefits to customers looking to upgrade their network infrastructure. Trust Texas Instruments to deliver cutting-edge technology that meets all your telecom needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly, making this product ideal for quick and cost-effective manufacturing processes.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used in electronic components, providing a standardized form factor for easy integration into various systems.

Power Supplies (V): 3.3

Operating at a low voltage of 3.3V, this product offers energy efficiency and compatibility with a wide range of power sources.

No. of Terminals: 18

With 18 terminals, this product allows for versatile connectivity options and can support complex circuit configurations.

Package Style (Meter): UNCASED CHIP

The uncased chip package style is compact and lightweight, making it suitable for space-constrained applications while ensuring reliable performance.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this product can withstand high temperature environments, offering robustness and reliability in demanding conditions.

Minimum Operating Temperature: -40 °C

Operating reliably at low temperatures down to -40°C, this product is suitable for use in a wide range of environmental conditions.

Terminal Position: UPPER

The upper terminal position makes it easy to access and connect to other components, simplifying the integration process and ensuring efficient assembly.

Width: 0.87 mm

The compact width of 0.87mm enables a high level of component density on PCBs, allowing for space-efficient designs and compact electronic devices.

Length: 1.036 mm

With a length of 1.036mm, this product offers a balanced form factor for easy placement on PCBs and compatibility with standard mounting processes.

Temperature Grade: INDUSTRIAL

Built to industrial temperature grade standards, this product can operate reliably in harsh industrial environments, ensuring long-term performance and durability.

Applications: SONET

Designed specifically for SONET applications, this product offers optimized performance and compatibility with SONET network infrastructure, making it an ideal choice for telecommunications applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and ensures compliance with environmental regulations, making this product a sustainable and eco-friendly choice.

Maximum Supply Current: 40 mA

The maximum supply current of 40mA ensures efficient power consumption and allows for safe operation within the specified limits, enhancing overall system reliability.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

As a dedicated ATM/SONET/SDH support circuit, this product is specifically designed to meet the requirements of telecommunications networks, providing enhanced signal processing capabilities and network performance.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, this product ensures compatibility with standard power sources and offers stable performance throughout its operational range.

Technical Specifications

ATM/SONET/SDH Circuits ONET8541TY attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Additional Features:

Data rate is 11.3 Gbps

Applications:

SONET

JESD-30 Code:

R-XUUC-N18

Length:

1.036 mm

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

40 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.87 mm

Trade Compliance

ONET8541TY Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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