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ONET1151LRGET

Texas Instruments

ONET1151LRGET by Texas Instruments

ONET1151LRGET by Texas Instruments is a 24-terminal telecom IC for SDH and SONET applications. It operates at temperatures from -40 to 100°C, with a supply voltage of 3.3V and max current of 135mA. The package style is chip carrier with a very thin profile, suitable for surface mount assembly.

Median Price

$7.588

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,599 parts In-Stock

1+ parts

$7.752

100+ parts

$6.320

1k+ parts

$4.213

10k+ parts

-

1,599

$7.752

$6.320

$4.213

-

DigiKey

USA . 6,827 parts In-Stock

1+ parts

-

100+ parts

$7.990

1k+ parts

-

10k+ parts

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6,827

-

$7.990

-

-

Verical

USA . 6,798 parts In-Stock

1+ parts

-

100+ parts

$7.588

1k+ parts

$6.787

10k+ parts

$6.388

6,798

-

$7.588

$6.787

$6.388

Rochester

USA . 6,327 parts In-Stock

1+ parts

-

100+ parts

$6.070

1k+ parts

$5.430

10k+ parts

$5.110

6,327

-

$6.070

$5.430

$5.110

Mouser Electronics

USA . 259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.740

10k+ parts

$5.710

259

-

-

$5.740

$5.710

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,162 parts In-Stock

1+ parts

$5.558

100+ parts

-

1k+ parts

-

10k+ parts

-

1,162

$5.558

-

-

-

Vyrian

USA . 3,565 parts In-Stock

1+ parts

$5.740

100+ parts

-

1k+ parts

-

10k+ parts

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3,565

$5.740

-

-

-

DigiKey Marketplace

USA . 9,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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9,089

-

-

-

-

Global Solutions Electronics Company

USA . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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40

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 113 parts In-Stock

1+ parts

$5.265

100+ parts

-

1k+ parts

-

10k+ parts

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113

$5.265

-

-

-

Parana Technologies

USA . 503 parts In-Stock

1+ parts

$14.413

100+ parts

-

1k+ parts

$14.854

10k+ parts

-

503

$14.413

-

$14.854

-

DigiPath Technology Company

USA . 1,706 parts In-Stock

1+ parts

$15.870

100+ parts

$14.601

1k+ parts

-

10k+ parts

-

1,706

$15.870

$14.601

-

-

IDEA Electronic Components Group

UK . 1,283 parts In-Stock

1+ parts

$16.194

100+ parts

$15.384

1k+ parts

$14.575

10k+ parts

-

1,283

$16.194

$15.384

$14.575

-

ChromeModa Solutions

Germany . 536 parts In-Stock

1+ parts

$16.194

100+ parts

$13.279

1k+ parts

-

10k+ parts

-

536

$16.194

$13.279

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-

Microchip USA

USA . 2,810 parts In-Stock

1+ parts

$20.250

100+ parts

$19.970

1k+ parts

$19.820

10k+ parts

$19.680

2,810

$20.250

$19.970

$19.820

$19.680

Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

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Overview

Upgrade your networking systems with the high-quality ONET1151LRGET by Texas Instruments. Designed for ATM/SONET/SDH circuits, this chip carrier with heat sink/slug package offers exceptional performance in industrial-grade applications like SDH and SONET. With a nominal supply voltage of 3.3V and maximum supply current of 135mA, this telecom IC type support circuit provides reliable connectivity and optimal functionality. Trust Texas Instruments for cutting-edge technology that delivers value and efficiency to your projects. Elevate your network capabilities with the ONET1151LRGET today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making it suitable for a wide range of operating conditions.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

No. of Terminals: 24

Provides ample connectivity options, allowing for versatility in circuit design and functionality.

Maximum Operating Temperature: 100 °C

Ensures reliable performance even in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Maintains functionality in low-temperature conditions, ensuring consistent operation in a variety of environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Offers excellent conductivity and corrosion resistance, ensuring signal integrity and longevity of the product.

Nominal Supply Voltage: 3.3 V

Operates efficiently at a common supply voltage, making it compatible with existing systems and components.

Technical Specifications

ATM/SONET/SDH Circuits ONET1151LRGET attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

135 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

ONET1151LRGET Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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