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PHY1076-01QD-RR

Analog Devices

PHY1076-01QD-RR by Analog Devices

PHY1076-01QD-RR by Analog Devices is an ATM/SONET/SDH circuit with 36 terminals in a square chip carrier package. Operating from -40 to 95 °C, it supports a 3.3V supply voltage for industrial telecom applications. With a very thin profile and no lead terminal form, it's ideal for compact designs requiring high reliability.

Median Price

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3

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1k+

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Vyrian

USA . 6,441 parts In-Stock

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Digiode

USA . 2,661 parts In-Stock

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Anansix

USA . 634 parts In-Stock

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AZTECH Wire

Italy . 863 parts In-Stock

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$7.586

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MARBEL Systems

Belgium . 642 parts In-Stock

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$10.035

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Texas Native Microelectronics

USA . 3,380 parts In-Stock

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$11.535

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$11.074

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$10.728

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$10.151

3,380

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$11.074

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$10.151

Kenton Components

USA . 281 parts In-Stock

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$13.842

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$12.181

281

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Qasali Group International

UK . 3,954 parts In-Stock

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$31.144

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$28.964

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$27.407

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Semicontronic

India . 847 parts In-Stock

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$716.000

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$698.100

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$694.520

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One Stop Electronics

USA . 1,783 parts In-Stock

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$800.000

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QUARKTWIN TECHNOLOGY LTD

USA . 3,758 parts In-Stock

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Corphita

USA . 2,715 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

USA . 1,858 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the PHY1076-01QD-RR by Analog Devices. This ATM/SONET/SDH circuit boasts superior quality and reliability, making it the go-to choice for telecom applications. With a surface mount design and industrial-grade temperature range, this chip carrier offers unmatched performance in a compact package. Discover the value of seamless connectivity and optimal functionality with the PHY1076-01QD-RR, providing customers with the ultimate solution for their communication needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

The square shape is commonly preferred for efficient use of space on the circuit board, maximizing component placement and layout.

No. of Terminals: 36

Having a higher number of terminals allows for more connections, making this product versatile and suitable for complex circuitry.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers thermal management through the heat sink/slug design while also being compact due to the very thin profile, ideal for applications where space is limited.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions or heavy usage without compromising performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures reliability and functionality in both extreme cold and hot conditions.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections, reducing the risk of signal interruptions or disconnections.

Maximum Seated Height: 0.95 mm

The low maximum seated height helps in maintaining a slim profile for the overall circuit board, enabling compact and sleek designs.

Width: 6 mm

A standard width of 6mm ensures compatibility with various circuit board layouts and configurations.

Length: 6 mm

The length of 6mm complements the width and allows for a compact form factor, optimizing space utilization on the board.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this product is designed to perform reliably in demanding industrial environments with fluctuating temperatures.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead-related issues such as solder weakness, ensuring long-term durability and stability.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Specifically designed to support ATM/SONET/SDH applications, making it a specialized and efficient choice for telecom networking circuits.

Nominal Supply Voltage: 3.3 V

Operates at a standard nominal supply voltage of 3.3V, compatible with common power sources in telecom equipment.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting, contributing to a more compact and efficient circuit board layout.

Technical Specifications

ATM/SONET/SDH Circuits PHY1076-01QD-RR attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N36

Length:

6 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.95 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

PHY1076-01QD-RR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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