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LMK04133SQX

Texas Instruments

LMK04133SQX by Texas Instruments

LMK04133SQX by Texas Instruments is a 48-terminal ATM/SONET/SDH circuit in a square chip carrier package. Operating temperature range from -40 to 85°C, with a nominal voltage of 3.3V. Ideal for industrial telecom applications requiring very thin profile components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,036 parts In-Stock

1+ parts

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5,036

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Vyrian

USA . 2,207 parts In-Stock

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2,207

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Anansix

USA . 1,096 parts In-Stock

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1,096

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,179 parts In-Stock

1+ parts

$9.162

100+ parts

$850.799

1k+ parts

$8.245

10k+ parts

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2,179

$9.162

$850.799

$8.245

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DigiPath Technology Company

USA . 377 parts In-Stock

1+ parts

$10.088

100+ parts

-

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377

$10.088

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ChromeModa Solutions

Germany . 6,852 parts In-Stock

1+ parts

$10.294

100+ parts

$8.441

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-

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6,852

$10.294

$8.441

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IDEA Electronic Components Group

UK . 412 parts In-Stock

1+ parts

$10.294

100+ parts

$9.779

1k+ parts

$9.265

10k+ parts

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412

$10.294

$9.779

$9.265

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AZTECH Wire

Italy . 828 parts In-Stock

1+ parts

$15.500

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828

$15.500

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One Stop Electronics

USA . 1,475 parts In-Stock

1+ parts

$674.000

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1,475

$674.000

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Corphita

USA . 1,454 parts In-Stock

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1,454

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Kepictronics

USA . 42 parts In-Stock

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42

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Overview

Experience unparalleled quality and reliability with the LMK04133SQX by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology for ATM/SONET/SDH Circuits, setting the standard for excellence. This versatile product offers customers immense value with its advanced features and wide range of applications. Trust in Texas Instruments to provide you with the best-in-class solutions for all your circuit needs, ensuring optimal performance and efficiency every time.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making it a convenient choice for manufacturers.

Package Shape: SQUARE

The square shape of the package provides stability and uniformity in placement on a circuit board, reducing the chances of misalignment during assembly.

No. of Terminals: 48

Having 48 terminals allows for a greater level of connectivity and functionality within the circuit, making it suitable for complex ATM/SONET/SDH circuits.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and a very thin profile design optimizes thermal management and space utilization, resulting in a high-performance and compact product.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliable performance under demanding conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this product suitable for use in a wide range of environmental conditions.

Terminal Position: QUAD

The quad terminal position offers enhanced connectivity options and supports efficient signal transmission within the circuit.

Maximum Seated Height: 0.8 mm

The maximum seated height of 0.8 mm allows for a low profile design, enabling compact and space-saving integration into circuit board layouts.

Width: 7 mm

The 7 mm width provides a balance between compactness and room for terminal placement, allowing for efficient use of space within the circuit board.

Length: 7 mm

The 7 mm length contributes to the overall compactness of the product, facilitating seamless integration into circuit board designs with limited space available.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets the stringent requirements for operation in harsh and demanding industrial environments.

Terminal Form: NO LEAD

The no lead terminal form enhances reliability and performance, as it eliminates the risk of solder joint failures common with traditional leaded components.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Specifically designed to support ATM/SONET/SDH circuits, this product ensures compatibility and seamless integration with telecommunications systems requiring such functionality.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage provides optimal power efficiency and compatibility with standard power sources, making it a practical choice for various applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for precise and reliable connections between terminals, ensuring signal integrity and facilitating smooth operation of the circuit.

Technical Specifications

ATM/SONET/SDH Circuits LMK04133SQX attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LMK04133SQX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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