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LMK04110SQ

Texas Instruments

LMK04110SQ by Texas Instruments

LMK04110SQ by Texas Instruments is a 48-terminal ATM/SONET/SDH circuit in a square chip carrier package. Operating temperature range from -40 to 85°C, with a nominal voltage of 3.3V. Ideal for industrial telecom applications requiring very thin profile components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,333 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,333

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-

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Vyrian

USA . 3,139 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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3,139

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Anansix

USA . 2,419 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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2,419

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 590 parts In-Stock

1+ parts

$10.136

100+ parts

$941.301

1k+ parts

$9.123

10k+ parts

-

590

$10.136

$941.301

$9.123

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DigiPath Technology Company

USA . 28 parts In-Stock

1+ parts

$11.161

100+ parts

$10.268

1k+ parts

-

10k+ parts

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28

$11.161

$10.268

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ChromeModa Solutions

Germany . 1,505 parts In-Stock

1+ parts

$11.389

100+ parts

$9.339

1k+ parts

-

10k+ parts

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1,505

$11.389

$9.339

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IDEA Electronic Components Group

UK . 636 parts In-Stock

1+ parts

$11.389

100+ parts

$10.820

1k+ parts

$10.250

10k+ parts

-

636

$11.389

$10.820

$10.250

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AZTECH Wire

Italy . 588 parts In-Stock

1+ parts

$19.162

100+ parts

-

1k+ parts

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10k+ parts

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588

$19.162

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One Stop Electronics

USA . 900 parts In-Stock

1+ parts

$433.000

100+ parts

-

1k+ parts

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900

$433.000

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Corphita

USA . 703 parts In-Stock

1+ parts

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100+ parts

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703

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Overview

Enhance your communication network with the high-quality LMK04110SQ by Texas Instruments. This advanced ATM/SONET/SDH circuit offers unparalleled reliability and performance, making it the ideal choice for a wide range of applications. With its innovative design and robust construction, this square package chip carrier provides seamless integration and precise functionality. Experience the value and benefits of Texas Instruments' cutting-edge technology, designed to elevate your communication systems to new heights. Upgrade to the LMK04110SQ today and unlock a world of possibilities for your network infrastructure.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting onto circuit boards, making installation and maintenance smooth and hassle-free.

Package Shape: SQUARE

The square shape of the package provides stability and makes it easy to fit into tight spaces within electronic devices.

No. of Terminals: 48

Having 48 terminals allows for a versatile and complex circuit design, enabling a wide range of functionality within the product.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier with heat sink/slug and very thin profile ensures efficient heat dissipation and space-saving design, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures functionality even in extremely cold environments, making it a reliable choice for various applications.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connection to external components, enhancing the overall reliability and performance of the product.

Maximum Seated Height: 0.8 mm

The low maximum seated height helps in keeping the overall profile of the product compact, making it suitable for applications with space constraints.

Width: 7 mm

The narrow width of 7 mm enables easy integration into circuit boards and electronic devices, ensuring a seamless and efficient setup.

Length: 7 mm

The compact length of 7 mm allows for a space-saving design while maintaining functionality, making it a practical choice for small electronic products.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh operating conditions and continue to deliver reliable performance in demanding environments.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of lead contamination and ensures a cleaner and safer manufacturing and usage process.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Specifically designed to support ATM/SONET/SDH circuits, this product offers optimized performance and compatibility for telecommunications applications.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this product offers efficient power consumption and compatibility with standard voltage requirements in electronic systems.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm allows for high-density mounting on circuit boards, providing enhanced connectivity and space efficiency within electronic devices.

Technical Specifications

ATM/SONET/SDH Circuits LMK04110SQ attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LMK04110SQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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