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LMK04111SQ/NOPB

Texas Instruments

LMK04111SQ/NOPB by Texas Instruments

LMK04111SQ/NOPB by Texas Instruments is a 48-terminal chip carrier with matte tin finish. It operates b/w -40 to 85°C, ideal for industrial applications like SDH and SONET. This telecom IC supports 2 channels at a nominal voltage of 3.3V, making it suitable for ATM/SONET/SDH circuits.

Median Price

$10.518

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,950 parts In-Stock

1+ parts

$10.518

100+ parts

$9.187

1k+ parts

$6.336

10k+ parts

-

1,950

$10.518

$9.187

$6.336

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,443 parts In-Stock

1+ parts

$9.992

100+ parts

-

1k+ parts

-

10k+ parts

-

2,443

$9.992

-

-

-

Vyrian

USA . 1,639 parts In-Stock

1+ parts

$10.518

100+ parts

-

1k+ parts

-

10k+ parts

-

1,639

$10.518

-

-

-

Anansix

USA . 508 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

508

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,319 parts In-Stock

1+ parts

$7.985

100+ parts

-

1k+ parts

$7.666

10k+ parts

$7.666

3,319

$7.985

-

$7.666

$7.666

Corphita

USA . 3,378 parts In-Stock

1+ parts

$9.466

100+ parts

-

1k+ parts

-

10k+ parts

-

3,378

$9.466

-

-

-

Parana Technologies

USA . 188 parts In-Stock

1+ parts

$13.213

100+ parts

-

1k+ parts

$13.719

10k+ parts

-

188

$13.213

-

$13.719

-

DigiPath Technology Company

USA . 402 parts In-Stock

1+ parts

$14.549

100+ parts

$13.385

1k+ parts

-

10k+ parts

-

402

$14.549

$13.385

-

-

ChromeModa Solutions

Germany . 2,418 parts In-Stock

1+ parts

$14.846

100+ parts

$12.174

1k+ parts

-

10k+ parts

-

2,418

$14.846

$12.174

-

-

IDEA Electronic Components Group

UK . 1,096 parts In-Stock

1+ parts

$14.846

100+ parts

$14.104

1k+ parts

$13.361

10k+ parts

-

1,096

$14.846

$14.104

$13.361

-

Microchip USA

USA . 1,818 parts In-Stock

1+ parts

$23.830

100+ parts

$23.490

1k+ parts

$23.320

10k+ parts

$23.150

1,818

$23.830

$23.490

$23.320

$23.150

Overview

Elevate your telecom systems with the LMK04111SQ/NOPB by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality ATM/SONET/SDH Circuits like this one, designed for superior performance and reliability. Perfect for SDH and SONET applications, this product offers customers unmatched value with its advanced features and industrial-grade construction. Upgrade your network with the LMK04111SQ/NOPB and experience the benefits of cutting-edge technology that Texas Instruments is known for. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation, saving time and effort.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand elevated temperatures without malfunctioning.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is commonly used in many applications, making this product compatible with a wide range of systems.

Applications: SDH; SONET

Designed for SDH and SONET applications, this product is specialized for high-speed data transmission in telecommunications networks.

Technical Specifications

ATM/SONET/SDH Circuits LMK04111SQ/NOPB attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

LMK04111SQ/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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