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LMK04102SQX

Texas Instruments

LMK04102SQX by Texas Instruments

LMK04102SQX by Texas Instruments is a 48-terminal ATM/SONET/SDH circuit in a square chip carrier package. Operating temperature range from -40 to 85°C, with a nominal voltage of 3.3V. Ideal for industrial telecom applications requiring very thin profile and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,643 parts In-Stock

1+ parts

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6,643

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Anansix

USA . 1,036 parts In-Stock

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1,036

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Digiode

USA . 329 parts In-Stock

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329

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 815 parts In-Stock

1+ parts

$7.534

100+ parts

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815

$7.534

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Parana Technologies

USA . 24 parts In-Stock

1+ parts

$12.754

100+ parts

-

1k+ parts

$13.219

10k+ parts

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24

$12.754

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$13.219

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DigiPath Technology Company

USA . 2,086 parts In-Stock

1+ parts

$14.043

100+ parts

$12.920

1k+ parts

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2,086

$14.043

$12.920

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ChromeModa Solutions

Germany . 3,705 parts In-Stock

1+ parts

$14.330

100+ parts

$11.751

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3,705

$14.330

$11.751

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IDEA Electronic Components Group

UK . 693 parts In-Stock

1+ parts

$14.330

100+ parts

$13.614

1k+ parts

$12.897

10k+ parts

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693

$14.330

$13.614

$12.897

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One Stop Electronics

USA . 637 parts In-Stock

1+ parts

$795.000

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637

$795.000

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Corphita

USA . 1,722 parts In-Stock

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1,722

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Overview

Elevate your network infrastructure with the LMK04102SQX by Texas Instruments. Designed for ATM/SONET/SDH circuits, this cutting-edge product boasts top-notch quality and reliability that TI is known for. With a compact square package and industrial temperature grade, it’s perfect for demanding telecom applications. Experience seamless performance and precision with its advanced features, offering unmatched value and benefits to customers looking to optimize their systems. Upgrade to the LMK04102SQX and take your network to the next level.

Feature Benefit Bullets

Surface Mount: YES

This surface mount feature allows for easy installation and space-saving on PCBs.

Package Shape: SQUARE

The square shape of the package provides stability and ease of handling during the manufacturing process.

No. of Terminals: 48

With a high number of terminals, this product offers a wide range of connectivity options for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style ensures efficient heat dissipation and compact design, making it suitable for tight spaces and demanding environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extremely cold environments.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections, enhancing overall reliability.

Maximum Seated Height: 0.8 mm

The low maximum seated height enables a compact and streamlined design, ideal for space-constrained applications.

Width: 7 mm

The width of 7mm provides a balance between compactness and ease of handling, making this product versatile for various installations.

Length: 7 mm

The length of 7mm contributes to the overall compactness and efficiency of the product, suitable for space-saving designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments, making this product durable and long-lasting.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and RoHS compliant, meeting modern sustainability standards.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Designed specifically for ATM/SONET/SDH circuits, this product provides optimized performance and compatibility for telecom applications.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is commonly used in telecom systems, ensuring compatibility and efficient power consumption.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density connections and precise signal transmission, essential for telecom circuit applications.

Technical Specifications

ATM/SONET/SDH Circuits LMK04102SQX attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LMK04102SQX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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