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MAX3873AETP+

Analog Devices

MAX3873AETP+ by Analog Devices

MAX3873AETP+ by Analog Devices is a BICMOS technology ATM/SONET/SDH clock recovery circuit with 20 terminals. It operates at 3.3V, has a max temp of 85 °C, and is suitable for SDH and SONET applications. The package style is chip carrier with matte tin finish, measuring 4x4mm in size.

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1k+

MAX3873AETP+ by Analog Devices
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Analog Devices Inc

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Digiode

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Vyrian

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Anansix

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Lantek

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Cyclops Electronics Ltd

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MARBEL Systems

Belgium . 321 parts In-Stock

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Texas Native Microelectronics

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$13.801

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Kenton Components

USA . 2,016 parts In-Stock

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Qasali Group International

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Semicontronic

India . 1,055 parts In-Stock

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A-Z Elektronik GmbH

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Microchip USA

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Speed Components Ltd (Excess)

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GreenTree Electronics

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Overview

Elevate your networking solutions with the MAX3873AETP+ by Analog Devices, a cutting-edge ATM/SONET/SDH circuit that sets the standard for quality and reliability. Designed with precision and expertise, this product offers customers unparalleled performance and efficiency in SDH and SONET applications. With a sleek surface mount design and industrial-grade temperature tolerance, the MAX3873AETP+ is the ideal choice for telecom professionals looking to optimize their systems. Experience the value and benefits of Analog Devices' innovative technology firsthand with this advanced clock recovery circuit.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes installation of this product easier and more efficient in electronic circuits.

Package Shape: SQUARE

Square package shape provides a compact and space-efficient design for the product.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V makes this product compatible with standard power supplies, offering ease of integration.

No. of Terminals: 20

With 20 terminals, this product allows for versatile connectivity and functionality within the circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles provides thermal efficiency, compactness, and high performance in various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product offers reliability and durability in diverse environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperature ensures the product's functionality in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and ensures long-term reliability in electrical connections.

Terminal Position: QUAD

Quad terminal position offers increased stability and connectivity in the circuitry.

Maximum Seated Height: 1 mm

The low seated height allows for a compact and slim design of the product, suitable for space-constrained installations.

Width: 4 mm

The narrow width of 4mm enables easy integration of the product into tight spaces and densely populated circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures efficient manufacturing processes with reduced risk of component damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability supports lead-free soldering processes for environmental compliance.

Length: 4 mm

The compact length of 4mm contributes to the overall space-saving design of the product.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments with varying temperature conditions.

Applications: SDH; SONET

Designed specifically for SDH and SONET applications, ensuring compatibility and optimized performance in telecommunications networks.

Technology: BICMOS

Utilizing Bipolar CMOS (BiCMOS) technology offers a combination of high-speed performance and low-power consumption for efficient operation.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental regulations and offers improved reliability in solder joints.

Maximum Supply Current: 0.142 mA

With a low maximum supply current of 0.142mA, this product helps in reducing power consumption and energy costs.

Telecom IC Type: ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

Featuring a clock recovery circuit specifically for ATM, SONET, and SDH applications, ensuring accurate clock synchronization in telecommunications systems.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and ease of system integration.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for compact and high-density packaging of the product, optimizing circuit board space.

Technical Specifications

ATM/SONET/SDH Circuits MAX3873AETP+ attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.142 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

MAX3873AETP+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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